Browse Topic: Copper
A novel sintering method of bridging the two mechanically polished and oriented single-crystals together face-to-face in a non- environmental controlled atmosphere to fabricate the bicrystal substrate of NaCl of macroscopic thickness, with a common zone axis and having planarity over large areas, has been developed. Epitaxial [001] bicrystalline thin face-centered cubic (fcc) metal film of surface-reactive metal-containing tilt grain boundary across the interface is first grown in high vacuum directly by flash deposition on initially fabricated [001] oriented bicrystalline substrate of NaCl. The [001] tilt boundary, thus produced, and is examined by electron microscopy to characterize grain boundary morphology and structure. The findings of some preliminary investigations are then presented. A distinct atomic structure is observed for 310 and 210 inclination. Both HAADF-STEM and Diffraction images reveal that such fabricated high-angle grain boundary accommodates minor deviations from
This specification covers polyvinyl chloride insulated single conductor electric wires made with tin-coated copper conductors or silver-coated copper alloy conductors. The polyvinyl chloride insulation of these wires may be used alone or in combination with other insulating or protective materials.
This specification covers one type of copper in the form of wire (see 8.5).
AS22759 specification covers fluoropolymer-insulated single conductor electrical wires made with tin-coated, silver-coated, or nickel-coated conductors of copper or copper alloy as specified in the applicable detail specification. The fluoropolymer insulation may be polytetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP), polyvinylidene fluoride (PVF2), ethylene-tetrafluoroethylene copolymer (ETFE), or other Fluoropolymer resin. The fluoropolymer may be used alone or in combination with other insulation materials. These abbreviations shall be used herein. When a wire is referenced herein, it means an insulated conductor (see 7.7).
This specification covers unalloyed copper in the form of sheet, strip, and plate at least 0.015 inch (0.38 mm) in nominal thickness.
A University of Bristol-led study, published in The Proceedings of the National Academy of Sciences, demonstrates how to make conductive, biodegradable wires from designed proteins. These could be compatible with conventional electronic components made from copper or iron, as well as the biological machinery responsible for generating energy in all living organisms.
The microstructure of the alloy and the manner in which it responds to heat treatment has been investigated. The alloy was aged at 550OC when it was initially spray-formed, or when its thickness was decreased by 38%. Before further aging of some specimens, a four-hour solution treatment at 1015OC was performed. The subsequent phase was a cold deformation that was barely 60% of the sample's initial thickness. The alloys' electrical conductivity and hardness may be evaluated based on how long they had been created. Following solution treatment and cold rolling, the alloy's peak hardness was around 380 kgf/mm2. In samples aged immediately under spray-produced conditions, the maximum peak hardness of 255 kgf/mm2 was attained. Conductivities in freshly cold-rolled samples could reach up to 75% of the standard for annealed copper internationally. It looks at the microstructural features of this alloy in this context, paying close attention to how various processing conditions affect them.
The AS81824 specification covers environment resistant, permanent crimp type, splices having heat shrinkable insulating sleeve and meltable environmental seals or heatless sealing sleeves. The splices may be used with tin, nickel, and silver-plated conductors in applications where the total temperature of the splice application does not exceed 200 °C or as specified in the detail specification.
This specification covers established inch/pound manufacturing tolerances applicable to copper and copper alloy seamless tubing ordered to inch/pound dimensions. These tolerances apply to all conditions, unless otherwise noted. The term “exclusive” is used to apply only to the higher figure of a specified range.
This specification covers elemental copper in the form of powder (see 8.5).
In an embedded world gone SOSA sensational, one might believe that centralized ATR-style OpenVPX systems are the best way to architect your next rugged system. While these chassis are routinely and successfully deployed on airborne, shipboard, and vetronics platforms, they are big, heavy, costly, and a real challenge to cool and connect. An alternate but equivalent rugged, deployable approach uses one or more small form factor chassis modules, distributed into any available space in the vehicle, interconnected via Apple® and Intel’s® 40Gbps Thunderbolt™ 4, a commercial open standard that uses USB Type-C connectors with a single, thin bi-directional copper or fiber cable.
In an embedded world gone SOSA sensational, one might believe that centralized ATR-style OpenVPX systems are the best way to architect your next rugged system. While these chassis are routinely and successfully deployed on airborne, shipboard, and vetronics platforms, they are big, heavy, costly, and a real challenge to cool and connect. An alternate but equivalent rugged, deployable approach uses one or more small form factor chassis modules, distributed into any available space in the vehicle, interconnected via Apple® and Intel's® 40Gbps Thunderbolt™ 4, a commercial open standard that uses USB Type-C connectors with a single, thin bi-directional copper or fiber cable. With 4, 8, even 16 3U or 6U LRU (line replacement unit) boards inside an ATR chassis, 600 watts is on the low end of systems that can push well over 2,000 watts in a 200 square inch footprint or less. Assuming one can find the space for such a chassis in the vehicle or platform, there's also the issue of cooling it
This specification covers an aluminum alloy in the form of sheet and plate 0.006 to 3.000 inches (0.15 to 76.20 mm), inclusive, in nominal thickness (see 8.5).
This specification covers established inch/pound manufacturing tolerances applicable to copper and copper alloy wire ordered to inch/pound dimensions. These tolerances apply to all conditions, unless otherwise noted.
Industrial startup and mechatronic pioneer Mirmex Motor has developed a new method of manufacturing high-power density electric micromotor windings. Constructed from flexible printed circuits and developed using artificial intelligence (AI), the micromotors can be up to 50 percent more compact and 70 percent more dynamic than traditional micromotors. They have three times fewer heat losses and are assembled 10 times faster than most existing motors that use conventional windings made from copper wire.
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