Browse Topic: Tin alloys

Items (150)

Tin Bronze Castings, Sand and Centrifugal, 87.5Cu - 10Sn - 2Zn, As Cast

AMS4845K (Current)

10/23/2025

This specification covers a tin bronze in the form of sand and centrifugal castings (see 8.5).

AMS D Nonferrous Alloys Committee

Effect of Ce and Cr Additions on the Physical and Mechanical Properties of Materials of Sn-9Zn Solder Alloy

05-19-02-0009

7/22/2025

With rising environmental concerns, developing lead-free solders is crucial for sustainable electronics. Traditional lead-based solders, while effective, pose health and environmental risks, prompt a shift to safer alternatives that retain reliability. Sn-9Zn alloys, when alloyed with elements such as cerium (Ce) and chromium (Cr), show enhanced mechanical and thermal properties suited for modern electronics. This study examines the effects of Ce and Cr, and their combination in Sn-9Zn solder alloy, analyzing improvements in microstructure, thermal, wettability, and hardness properties. Microstructural analysis reveals that Ce and Cr additions refine the alloy’s structure, benefiting performance. Wettability testing shows that Sn-9Zn-0.05Ce achieves the lowest wetting angle, while Sn-9Zn-0.05Ce-0.1Cr displays a balanced angle between Sn-9Zn-0.05Ce and Sn-9Zn-0.1Cr. Differential scanning calorimetry (DSC) results indicate that Sn-9Zn-0.05Ce has the lowest melting temperature, while Sn-9Zn-0.1Cr has the highest, with Ce and Cr together reducing the melting temperature by 2.83°C from the peak in Sn-9Zn-0.1Cr. Apart from this, the Vickers microhardness test reveals the highest hardness in Sn-9Zn-0.05Ce-0.1Cr with 19.62 HV, underscoring the strengthening effects of Ce and Cr. The outcomes suggest Ce and Cr alloying as a promising approach to enhance the performance of lead-free solders in eco-friendly electronics.

Kumar, Niranjan, Maurya, Ambrish

Rings, Sealing, Cast Tin Bronze, 80Cu - 19Sn, As Cast

AMS7322H (Current)

3/5/2025

This specification covers a cast tin bronze in the form of sealing rings (see 8.5).

AMS D Nonferrous Alloys Committee

Aluminum Bronze Bars, Rods, and Forgings, 90.5Cu - 7.5Al - 1.9Si, Stress Relieved

AMS4634E (Current)

2/25/2025

This specification covers an aluminum bronze alloy in the form of bars, rods, forgings, and forging stock.

AMS D Nonferrous Alloys Committee

Rings, Sealing, Cast Leaded-Tin Bronze, 80Cu - 16Sn - 5Pb As Cast

AMS7320H (Current)

10/1/2024

This specification covers a cast leaded-tin bronze in the form of sealing rings (see 8.5).

AMS D Nonferrous Alloys Committee

Aluminum Bronze Alloy, Sand Castings, 85Cu - 11Al - 3.6Fe, Solution Heat Treated and Tempered

AMS4873G (Current)

9/10/2024

This specification covers an aluminum bronze alloy in the form of sand castings (see 8.5).

AMS D Nonferrous Alloys Committee

Silicon Bronze Bars, Rods, Forgings, and Tubing 92Cu - 3.2Si - 2.8Zn - 1.5Fe Stress Relieved

AMS4616H (Current)

2/1/2024

This specification covers one type of bronze in the form of bars, rods, forgings, tubing, and forging stock (see 8.5).

AMS D Nonferrous Alloys Committee

Preparation of Copper Zinc Tin Sulfide Thin Film Solar Cells by Chemical Synthesis

2023-28-0139

11/10/2023

Cu2ZnSnS4 (CZTS) is a promising quaternary semiconducting absorber layer in thin film heterojunction solar cells. All the elements of this compound semiconductor were abundant, inexpensive, and non-toxic, hence CZTS is an alternative emerging optoelectronic material for Cu(In,Ga)Se2 and CdTe solar cells. Using the traditional spray approach, these films were effectively grown at an ideal substrate temperature of 643 K. The deposited films are found to be a kesterite structure using X-ray diffraction studies. The lattice parameters are calculated from the XRD spectrum and are found to be a = b = 5.44 Å and c = 10.86 Å. The energy band gap and optical absorption coefficient are found to be 1.50 eV and above 104 cm-1 respectively. The material exhibits p-type conductivity. After the chemical spray pyrolysis is completed, the deposited films remain on the hot plate, thus improving the films' crystallinity. A Cu2ZnSnS4 solar cell is fabricated using entirely chemical synthesis methods. The absorber layer has been deposited using spray pyrolysis deposition. CdS used as the buffer layer and these films have been successfully deposited through chemical bath deposition. The thin film solar cell exhibits an open circuit voltage and short circuit current of 286 mV and 2.6 mA/cm2. To attain reasonable efficiency, work is being done.

Kumar, YB Kishore, YB, Kiran, Tarigonda, Hariprasad, Doddipalli, Raghurami Reddy

Aluminum Bronze, Bars, Rods, Shapes, Tubes, and Forgings 81.5Cu - 10.0Al - 4.8Ni - 3.0Fe Drawn and Stress Relieved (HR50) or Temper Annealed (TQ50)

AMS4640J (Current)

11/10/2023

This specification covers an aluminum bronze alloy in the form of bars, rods, shapes, tubes, forgings, and forging stock (see 8.5).

AMS D Nonferrous Alloys Committee

Plating, Brush, Tin-Zinc Low Hydrogen Embrittlement

AMS2451/10C (Current)

6/27/2023

This specification covers the requirements for brush plating of tin-zinc by electrodeposition.

AMS B Finishes Processes and Fluids Committee

BEARING, PLAIN, SELF-ALIGNING, CHAMFERED OUTER RING

AS21155C (Current)

6/2/2023

ACBG Plain Bearing Committee

Using 3D Printing to Strengthen Jet Engines

TBMG-48257

6/1/2023

Skoltech engineers have used a 3D printer to fabricate — and investigate the mechanical characteristics of — samples of bronze-steel alloys previously unknown to materials science. Blending the distinct properties of bronze and steel, the novel alloys could be used to manufacture combustion chambers for aircraft and rocket engines. These would benefit from both steel’s ability to withstand extreme temperatures and bronze’s capacity to conduct heat away from the chamber.

Cross Reference for Materials for Fluid Systems Components, Including Military and Federal Specifications and Their International Equivalents

AIR1564C (Current)

8/19/2022

This SAE Aerospace Report (AIR) provides a cross reference for SAE material standards to other similar standards. The SAE Committee G-3 invites comments and recommendations for the addition of materials and information for inclusion into this informational report. No attempt has been made to obtain samples of the materials or conduct physical and chemical analyses to determine if they are equivalent. Anyone using this AIR, therefore, is cautioned to verify for themselves the interchangeabillity of the specific materials. Additional contributions of missing or supplemental data should be directed to SAE marked for the attention of Committee G-3.

G-3, Aerospace Couplings, Fittings, Hose, Tubing Assemblies

Wire, Phosphor Bronze 94Cu - 5.0Sn - 0.19P Cold Drawn, Spring Temper (H08)

AMS4720J (Current)

6/20/2022

This specification covers one type of bronze in the form of round wire 0.500 inch (12.70 mm) and under in nominal diameter (see 8.5).

AMS D Nonferrous Alloys Committee

Tin Electrode Amplifies Supercapacitors

TBMG-455284/1/2022

High-capacity, fast-charging supercapacitor energy storage devices have been limited by the composition of their electrodes — the connections responsible for managing the flow of electrons during charging and dispensing energy. Researchers have now developed a better material to improve connectivity while maintaining recyclability and low cost.

Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts

GEIASTD0006C (Current)

10/26/2021

This standard defines the requirements for fully replacing undesirable surface finishes using robotic hot solder dip. Requirements for qualifying and testing the refinished piece parts are also included. This standard covers the replacement of pure tin and Pb-free tin alloy finishes with SnPb finishes with the intent of subsequent assembly with SnPb solder. This dipping is different from dipping to within some distance of the body for the purposes of solderability; solder dipping for purposes other than full replacement of pure tin and Pb-free tin alloy finishes are beyond the scope of this document. It covers process and testing requirements for robotic dipping process and does not cover semi-automatic or purely manual dipping processes. This standard does not apply to piece-part manufacturers who build piece parts with a hot solder dip finish. It applies to refinishing performed by a robotic hot solder dip service supplier or production facilities at the customer, whenever the intent of the dipping is to have full coverage and replacement of Pb-free tin. Replacement of BGA spheres or CGA columns is not included in the scope of this standard. IEC TS 62647-4 may be used for replacement of BGA spheres. The intent of this standard is for suppliers and customers to incorporate these requirements into their operations to provide a consistent and well-controlled process for product applications that require significant control. Complete conversion of termination finishes from Pb-free tin to SnPb will allow use of piece parts for any of the Control Levels of GEIA-STD-0005-2 without mitigations. In addition to the elimination of tin whisker risks, piece parts processed to this standard will also exhibit enhanced solderability and solder joint reliability compared to most COTS finishes. Each customer shall determine the applicability of this standard and the need for full replacement of the existing termination finish. This standard does not guarantee a particular yield or reliability of piece parts going through solder dipping. Some applications may have unique requirements that exceed the scope of this standard and should be specified separately. Pb-free tin piece parts which have been dipped in compliance with this standard are no longer considered to be Pb-free tin finished for the purposes of GEIA-STD-0005-2.

G-24 Pb-free Risk Management Committee for ADHP

TERMINALS, LUG AND SPLICES, CONDUCTOR, CRIMP STYLE, COPPER TERMINAL, LUG, CRIMP STYLE, COPPER, INSULATED, RING TONGUE, FOR THIN WALL WIRE, TYPE II CLASS 1 FOR 105 °C TOTAL CONDUCTOR TEMPERATURE

AS7928/1E (Historical)9/21/2021

AE-8C2 Terminating Devices and Tooling Committee

TERMINALS, LUG AND SPLICES, CONDUCTOR, CRIMP STYLE, COPPER, INSULATED, RECTANGULAR TONGUE, TIN WHISKER RESISTANT FOR THIN WALL WIRE, TYPE II, CLASS 1 FOR 105 °C TOTAL CONDUCTOR TEMPERATURE

AS7928/9C (Current)

8/3/2021

AE-8C2 Terminating Devices and Tooling Committee

TERMINALS, LUG AND SPLICES, CONDUCTOR, CRIMP STYLE, COPPER TERMINAL, LUG, CRIMP STYLE, COPPER, INSULATED, RING TONGUE, FOR THIN WALL WIRE, TIN WHISKER RESISTANT, TYPE II CLASS 1 FOR 105 °C TOTAL CONDUCTOR TEMPERATURE

AS7928/8B (Historical)

5/28/2021

AE-8C2 Terminating Devices and Tooling Committee

TERMINALS, LUG AND SPLICES, CONDUCTOR, CRIMP STYLE, COPPER, INSULATED, RECTANGULAR TONGUE, TIN WHISKER RESISTANT FOR THIN WALL WIRE, TYPE II, CLASS 1 FOR 105 °C TOTAL CONDUCTOR TEMPERATURE

AS7928/9B (Historical)

2/26/2021

AE-8C2 Terminating Devices and Tooling Committee

Risk Mitigation for Pb-Free Solders Used Internally to Parts

ARP6537 (Current)

10/19/2020

This document provides risk mitigation for Pb-free solders used internal to parts used in Aerospace and Defense applications. It will include mitigations applicable to encapsulated and cavity devices as the needs arise in industry. Currently this revision only addresses devices with encapsulation or underfill. Mitigations for open cavity devices are still being discussed, and will be addressed in future revisions. Microbumps with Thermal Compression Bonding (TCB) are not addressed by the mitigations in this document. The use of Pb-free microbumps with TCB are considered out of scope at this time. It is expected that this document will be primarily used by Control Levels 3 and 2C (as defined in GEIA-STD-0005-2 for programs that do not allow use of Pb-free tin or only allow its use on an exception basis). It may be used by other levels, or by applications not using GEIA-STD-0005-2.

G-24 Pb-free Risk Management Committee for ADHP

TERMINAL, LUG, CRIMP STYLE, COPPER, INSULATED, RING TONGUE, BELL-MOUTHED, TYPE II, CLASS 1 (FOR 105 °C TOTAL CONDUCTOR TEMPERATURE)

AS25036E (Historical)

8/17/2020

AE-8C2 Terminating Devices and Tooling Committee

TERMINAL, LUG, CRIMP STYLE, COPPER, INSULATED, RING TONGUE, BELL-MOUTHED, TIN WHISKER RESISTANT, TYPE II, CLASS 1, (FOR 105 °C TOTAL CONDUCTOR TEMPERATURE)

AS7928/12E (Historical)

4/21/2020

AE-8C2 Terminating Devices and Tooling Committee

TERMINALS, LUG AND SPLICES, CONDUCTOR, CRIMP STYLE, COPPER TERMINAL, LUG, INSULATED, TIN WHISKER RESISTANT, RING TONGUE, BELL-MOUTHED, TYPE II, CLASS 1 (FOR 150 °C TOTAL CONDUCTOR TEMPERATURE)

AS7928/13C (Historical)

3/24/2020

AE-8C2 Terminating Devices and Tooling Committee

Synchros, General Specification for

AS20708C (Current)

6/5/2019

This specification relates to Synchros, 60 and 400 Hz. It is not complete in itself, but shall be used in conjunction with MIL-DTL-81963, in which the latter shall be recognized as forming an inherent part of this specification. This standard requires a Qualified Products List (see 6.4).

AE-7A Generators and Controls Motors and Magnetic Devices

Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts

GEIASTD0006B (Historical)

4/1/2019

This standard defines the requirements for fully replacing undesirable surface finishes using robotic hot solder dip. Requirements for qualifying and testing the refinished piece parts are also included. This standard covers the replacement of pure tin and Pb-free tin alloy finishes with SnPb finishes with the intent of subsequent assembly with SnPb solder. This dipping is different from dipping to within some distance of the body for the purposes of solderability; solder dipping for purposes other than full replacement of pure tin and other Pb-free tin alloy finishes are beyond the scope of this document. It covers process and testing requirements for robotic dipping process and does not cover semi-automatic or purely manual dipping processes. This standard does not apply to piece-part manufacturers who build piece parts with a hot solder dip finish. It applies to refinishing performed by a robotic hot solder dip service supplier or production facilities at the customer, whenever the intent of the dipping is to have full coverage and replacement of Pb-free tin. Replacement of BGA spheres or CGA columns is not included in the scope of this standard. IEC TS 62647-4 may be used for replacement of BGA spheres. The intent of this standard is for suppliers and customers to incorporate these requirements into their operations to provide a consistent and well-controlled process for product applications that require significant control. Complete conversion of termination finishes from Pb-free to SnPb will allow use of piece parts for any of the Control Levels of GEIA-STD-0005-2 without mitigations. In addition to the elimination of tin whisker risks, piece parts processed to this standard will also exhibit enhanced solderability and solder joint reliability compared to most COTS finishes. Each customer shall determine the applicability of this standard and the need for full replacement of the existing termination finish. This standard does not guarantee a particular yield or reliability of piece parts going through solder dipping. Some applications may have unique requirements that exceed the scope of this standard and should be specified separately. Pb-free tin piece parts which have been dipped in compliance with this standard are no longer considered to be Pb-free tin finished for the purposes of GEIA-STD-0005-2.

G-24 Pb-free Risk Management Committee for ADHP

AVOIDANCE OF HYDROGEN EMBRITTLEMENT OF STEEL FASTENERS AND OTHER HARDENED OR SPRING STEEL PARTS FROM SURFACE COATING PROCESSES

USCAR5-5 (Current)

2/27/2019

This standard outlines the conditions that enhance the risk of hydrogen embrittlement of steel and define the relief procedures required to minimize the risk of hydrogen embrittlement. It is intended to control the process.

USCAR

Guide for Achieving Plating/Finishing Compatibility with Connectors and Accessories used in Electrical Wiring Interconnect Systems (EWIS)

ARP6903A (Current)

8/29/2018

The intent of this ARP is to provide guidance to assist users in choosing compatible component finishes/platings to achieve the best corrosion resistance performance for compatible components/couples. This SAE Recommended Practice is intended as a guide toward standard practice and is subject to change to keep pace with experience and technical advances. A galvanic compatibility table is provided to assist with the compatible plating/finish selection. Specific plating performance parameters for each individual plating and each connector/accessory specification have also been provided to assist the product user with compatible plating/finish selection.

AE-8C1 Connectors Committee

Rings, Sealing, Cast Tin Bronze 80Cu - 19Sn As Cast

AMS7322G (Historical)

8/22/2018

This specification covers a cast tin bronze in the form of sealing rings.

AMS D Nonferrous Alloys Committee

Silicon Bronze Bars, Rods, Forgings, and Tubing 92Cu - 3.2Si - 2.8Zn - 1.5Fe Stress Relieved

AMS4616G (Historical)

4/28/2018

This specification covers one type of bronze in the form of bars, rods, forgings, tubing, and forging stock.

AMS D Nonferrous Alloys Committee

Bearings, Babbitt 91Sn – 4.5Sb – 4.5Cu

AMS4800F (Current)

4/19/2018

This specification covers bearings of a tin alloy cast on one or both faces of a steel or bronze backing.

AMS D Nonferrous Alloys Committee

Bearing and Bushing Alloys

J459_201801 (Current)

1/10/2018

The bearing performance of steel backed half bearings, bushings, and washers is dependent on the properties and thickness of the lining alloy, the strength and dimensional stability of the steel backing (usually SAE 1010) and the strength of the bond between the lining alloy and the backing. This SAE Information Report is primarily concerned with the properties of the lining alloys used in automotive applications, in particular, the crankshaft bearings of the internal combustion engine.

Metals Technical Committee

Wrought and Cast Copper Alloys

J461_201801 (Current)

1/9/2018

For convenience, this SAE Information Report is presented in two parts as shown below. To avoid repetition, however, data applicable to both wrought and cast alloys is included only in Part 1. Part I—Wrought Copper and Copper Alloys Types of Copper (Table 1) General Characteristics (Table 3) Electrical Conductivity Thermal Conductivity General Mechanical Properties (Table 10) Yield Strength Fatigue Strength Physical Properties (Table 2) General Fabricating Properties (Table 3) Formability Bending Hot Forming Machinability Joining Surface Finishing Color Corrosion Resistance Effect of Temperature Typical Uses (Table 3) Part II—Cast Copper Alloys Types of Casting Alloys Effects of Alloy Elements and Impurities General Characteristics (Table 11) Physical Properties (Table 12) Typical Uses (Table 11)

Metals Technical Committee

Plating of Aluminum for Solderability Zinc Immersion Pre-Treatment Process

AMS2420E (Historical)

11/3/2017

This specification covers the requirements for preparation of aluminum and aluminum alloys for soldering by zinc immersion pre-treatment followed by copper plating and tin or tin-zinc alloy plating.

AMS B Finishes Processes and Fluids Committee

TERMINAL, LUG, CRIMP STYLE, COPPER, UNINSULATED, RING TONGUE, TYPE I, CLASS 1, FOR 175 °C OR 260 °C TOTAL CONDUCTOR TEMPERATURE

AS20659F (Historical)

8/29/2017

AE-8C2 Terminating Devices and Tooling Committee

Guide for Achieving Plating/Finish Compatibility with Connectors and Accessories used in Electrical Wiring Interconnect Systems (EWIS)

ARP6903 (Historical)

3/17/2017

The intent of this ARP is to provide guidance to assist users in choosing compatible component finishes/platings to achieve the best corrosion resistance performance for compatible components/couples. This SAE Recommended Practice is intended as a guide toward standard practice and is subject to change to keep pace with experience and technical advances. A galvanic compatibililty table is provided to assist with the compatible plating/finish selection. Specific plating performance parameters for each individual plating and each connector/accessory specification have also been provided to assist the product user with compatible plating/finish selection.

AE-8C1 Connectors Committee

Interference between Tin Sulfides, Graphite and Novolak Oxidation

05-11-01-0009

3/7/2017

Tin sulfides (SnS and SnS2), represent a safer and greener alternative to other metal sulfides such as copper sulfides, and MoS2 etc. Their behavior is usually associated to that of solid lubricants such as graphite. A mixture of tin sulfides, with the 65 wt% of SnS2, has been characterized by scanning electron microscopy and by thermal gravimetric analysis (TGA). In order to investigate the effect of tin sulfides upon two crucial friction material ingredients, two mixtures were prepared: the former was made by mixing tin sulfides with a natural flake graphite and the latter was made mixing tin sulfides with a straight novolak. They were analyzed by TGA and differential thermal analysis (DTA) in both nitrogen and air. Some interferences were detected between tin sulfides and graphite in air. However, the oxidation of tin sulfides was concomitant with that of the novolak so that the resin onset decomposition-oxidation was considerably shifted to higher temperatures allowing the resin to work as a binder also in a critical temperature range. This is an additional benefit of tin sulfides apart acting as a solid lubricant.

Dante, Roberto, Sliepcevich, Andrea, Andreoni, Marco, Cotilli, Mario

Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder and Finishes

GEIAHB0005_2 (Current)

6/17/2016

This document is intended for use as technical guidance by Aerospace system suppliers, e.g., Aerospace system Original Equipment Manufacturers (OEMs) and Aerospace system maintenance facilities, in developing and implementing designs and processes to assure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems (subsequently referred to as AHP) both during and after the transition to Pb-Free electronics. This document is intended for application to aerospace products; however, it may also be applied, at the discretion of the user, to other products with similar characteristics, e.g., low-volume, rugged use environments, high reliability, long lifetime, and reparability. If other industries wish to use this document, they may substitute the name of their industry for the word “Aerospace” in this document. The guidelines may be used by the OEMs and maintenance facilities to implement the methodologies they use to assure the performance, reliability, airworthiness, safety, and certifiability of their products, in accordance with Document GEIA-STD-0005-1, “Performance Standard for High Performance Electronic Systems Containing Pb-Free Solder.” This document also contains lessons learned from previous experience with Pb-Free aerospace electronic systems. The lessons learned give specific references to solder alloys and other materials, and their expected applicability to various operating environmental conditions. The lessons learned are intended for guidance only; they are not guarantees of success in any given application.

G-24 Pb-free Risk Management Committee for ADHP

Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts

GEIASTD0006A (Historical)

2/24/2016

This standard defines the requirements for fully replacing undesirable surface finishes using robotic hot solder dip. Requirements for qualifying and testing the refinished piece parts are also included. This standard covers the replacement of pure tin and Pb-free tin alloy finishes with SnPb finishes with the intent of subsequent assembly with SnPb solder. This dipping is different from dipping to within some distance of the body for the purposes of solderability; solder dipping for purposes other than full replacement of pure tin and other Pb-free tin alloy finishes are beyond the scope of this document. It covers process and testing requirements for robotic dipping process and does not cover semi-automatic or purely manual dipping processes. This standard does not apply to piece-part manufacturers who build piece parts with a hot solder dip finish. It applies to refinishing performed by a robotic hot solder dip service supplier or production facilities at the customer, whenever the intent of the dipping is to have full coverage and replacement of Pb-free tin. Replacement of BGA spheres or CGA columns is not included in the scope of this standard. The intent of this standard is for suppliers and customers to incorporate these requirements into their operations to provide a consistent and well-controlled process for product applications that require significant control. Complete conversion of termination finishes from Pb-free to SnPb will allow use of piece parts for any of the Control Levels of GEIA-STD-0005-2 without mitigations. In addition to the elimination of tin whisker risks, piece parts processed to this standard will also exhibit enhanced solderability and solder joint reliability compared to most COTS finishes. Each customer shall determine the applicability of this standard and the need for full replacement of the existing termination finish. This standard does not guarantee a particular yield or reliability of piece parts going through solder dipping. Some applications may have unique requirements that exceed the scope of this standard, and should be specified separately. Pb-free tin piece parts which have been dipped in compliance with this standard are no longer considered to be Pb-free tin finished for the purposes of GEIA-STD-0005-2.

G-24 Pb-free Risk Management Committee for ADHP

Program Management/Systems Engineering Guidelines for Managing the Transition to Lead-Free Electronics

GEIAHB0005_1A (Current)

2/24/2016

This handbook is designed to assist a program in assuring the performance, reliability, airworthiness, safety, and certifiability of product(s), in accordance with GEIA-STD-0005-1, “Performance Standard for Aerospace and High Performance Electronic Systems Containing Pb-free Solder”. Please note that the program manager, and managers of systems engineering, Supply Chain and Quality Assurance (along with their respective organizations), and the appropriate enterprise authority need to work together in ensuring that all impacts of Pb-free technology insertion are understood and risks mitigated accordingly. Herein “program management (or manager), supplier chain management (or manager), quality assurance management (or manager) and systems engineering management (or manager) and/or the appropriate enterprise authority” shall be defined as “responsible manager” throughout the remaining document (see Section 3, Terms and Definitions). The basic principles delineated in this handbook can be used for program management, system engineering, supply chain management and quality assurance management of any aerospace and/or high performance program. Appendix A contains a General Responsible Manager Checklist for Dealing with Pb-free Issues. The checklist can be used to identify potential issues related to the content in sections 5 through 15 of this handbook. Pb-free technology can impact any program regardless of whether the program itself is exempt or bound by environmental regulations. The industry conversion to Pb-free solder technology may affect manufacturers and consumers of ADHP electronics in one or combinations of the following three ways: (1) If the program is required to implement Pb-free technology (contract requirement, environmental regulation, etc), then the managers of organizations responsible for program execution will need to assess the impact of in-house transition with respect to design (e.g., performance of products using Pb-free) and process (e.g., processes to build Pb-free products). (2) If the program purchases COTS (Commercial-off-the-Shelf) items for its products/systems, then there is a very good chance that these items will contain Pb-free solder or Pb-free finishes on parts, PWBs, or PBAs. (3) Manufacturers of ADHP electronics may inadvertently introduce Pb-free parts or assemblies (including component finish, Printed Wiring Board (PWB) finish, or assembly solder) if careful coordination between buyer and supplier is not exercised.

G-24 Pb-free Risk Management Committee for ADHP

TERMINALS, LUG AND SPLICES, CONDUCTOR, CRIMP STYLE, COPPER, INSULATED, RECTANGULAR TONGUE, FOR THIN WALL WIRE, TYPE II, CLASS 1 FOR 105 °C TOTAL CONDUCTOR TEMPERATURE

AS7928/2C (Historical)

2/9/2016

AE-8C2 Terminating Devices and Tooling Committee

TERMINALS, LUG AND SPLICES, CONDUCTOR, CRIMP STYLE, COPPER, INSULATED, RECTANGULAR TONGUE, TIN WHISKER RESISTANT FOR THIN WALL WIRE, TYPE II, CLASS 1 FOR 105 °C TOTAL CONDUCTOR TEMPERATURE

AS7928/9A (Historical)

2/2/2016

AE-8C2 Terminating Devices and Tooling Committee

TERMINALS, LUG AND SPLICES, CONDUCTOR, CRIMP STYLE, SPLICE, ELECTRIC (PERMANENT, TYPE II, CLASS 1) FOR 105 °C TOTAL CONDUCTOR TEMPERATURE

AS7928/5B (Historical)

2/2/2016

AE-8C2 Terminating Devices and Tooling Committee

AS7928/8A (Historical)

12/27/2015

AE-8C2 Terminating Devices and Tooling Committee

TERMINALS, LUG AND SPLICES, CONDUCTOR, CRIMP STYLE, COPPER TERMINAL, LUG, INSULATED, TIN WHISKER RESISTANT, RING TONGUE, BELL-MOUTHED, TYPE II, CLASS 1 (FOR 105 °C TOTAL CONDUCTOR TEMPERATURE)

AS7928/13B (Historical)

12/27/2015

AE-8C2 Terminating Devices and Tooling Committee

TERMINAL, LUG, CRIMP STYLE, COPPER, UNINSULATED, RING TONGUE, TYPE I, CLASS 1, FOR 175 °C TOTAL CONDUCTOR TEMPERATURE

AS20659E (Historical)

12/27/2015

AE-8C2 Terminating Devices and Tooling Committee

TERMINALS, LUG AND SPLICES, CONDUCTOR, CRIMP STYLE, COPPER TERMINAL, LUG, CRIMP STYLE, COPPER, INSULATED, RING TONGUE, FOR THIN WALL WIRE, TYPE II CLASS 1 FOR 105 °C TOTAL CONDUCTOR TEMPERATURE

AS7928/1D (Historical)12/27/2015

AE-8C2 Terminating Devices and Tooling Committee

TERMINAL, LUG, CRIMP STYLE, COPPER, INSULATED, RING TONGUE, BELL-MOUTHED, TIN WHISKER RESISTANT, TYPE II, CLASS 1, (FOR 105 °C TOTAL CONDUCTOR TEMPERATURE)

AS7928/12D (Historical)

12/2/2015

AE-8C2 Terminating Devices and Tooling Committee

Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems

GEIAHB0005_3 (Current)

9/17/2015

This document provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as SnPb or Pb-free alloys, or a combination of both solders and surface finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the technical structure to allow the repair technician to execute the task. This document focuses on the removal and replacement of piece parts. For the purposes of this document, the term “Rework/Repair” is used as applicable. NOTE: The information contained within this document is based on the current knowledge of the industry at the time of publication. Due to the rapid changing knowledge base, this document should be used for guidance only.

G-24 Pb-free Risk Management Committee for ADHP

TERMINALS, LUG AND SPLICES, CONDUCTOR, CRIMP STYLE, COPPER TERMINAL, LUG, INSULATED, TIN WHISKER RESISTANT, RING TONGUE, BELL-MOUTHED, TYPE II, CLASS 1 (FOR 105°C TOTAL CONDUCTOR TEMPERATURE)

AS7928/13A (Historical)

2/24/2015

AE-8C2 Terminating Devices and Tooling Committee

Items per page:

1 – 50 of 150