Browse Topic: Tin alloys

Items (149)
With rising environmental concerns, developing lead-free solders is crucial for sustainable electronics. Traditional lead-based solders, while effective, pose health and environmental risks, prompt a shift to safer alternatives that retain reliability. Sn-9Zn alloys, when alloyed with elements such as cerium (Ce) and chromium (Cr), show enhanced mechanical and thermal properties suited for modern electronics. This study examines the effects of Ce and Cr, and their combination in Sn-9Zn solder alloy, analyzing improvements in microstructure, thermal, wettability, and hardness properties. Microstructural analysis reveals that Ce and Cr additions refine the alloy’s structure, benefiting performance. Wettability testing shows that Sn-9Zn-0.05Ce achieves the lowest wetting angle, while Sn-9Zn-0.05Ce-0.1Cr displays a balanced angle between Sn-9Zn-0.05Ce and Sn-9Zn-0.1Cr. Differential scanning calorimetry (DSC) results indicate that Sn-9Zn-0.05Ce has the lowest melting temperature, while Sn
Kumar, NiranjanMaurya, Ambrish
This specification covers a cast tin bronze in the form of sealing rings (see 8.5).
AMS D Nonferrous Alloys Committee
This specification covers an aluminum bronze alloy in the form of bars, rods, forgings, and forging stock.
AMS D Nonferrous Alloys Committee
This specification covers a cast leaded-tin bronze in the form of sealing rings (see 8.5).
AMS D Nonferrous Alloys Committee
This specification covers an aluminum bronze alloy in the form of sand castings (see 8.5).
AMS D Nonferrous Alloys Committee
This specification covers one type of bronze in the form of bars, rods, forgings, tubing, and forging stock (see 8.5).
AMS D Nonferrous Alloys Committee
This specification covers an aluminum bronze alloy in the form of bars, rods, shapes, tubes, forgings, and forging stock (see 8.5).
AMS D Nonferrous Alloys Committee
Cu2ZnSnS4 (CZTS) is a promising quaternary semiconducting absorber layer in thin film heterojunction solar cells. All the elements of this compound semiconductor were abundant, inexpensive, and non-toxic, hence CZTS is an alternative emerging optoelectronic material for Cu(In,Ga)Se2 and CdTe solar cells. Using the traditional spray approach, these films were effectively grown at an ideal substrate temperature of 643 K. The deposited films are found to be a kesterite structure using X-ray diffraction studies. The lattice parameters are calculated from the XRD spectrum and are found to be a = b = 5.44 Å and c = 10.86 Å. The energy band gap and optical absorption coefficient are found to be 1.50 eV and above 104 cm-1 respectively. The material exhibits p-type conductivity. After the chemical spray pyrolysis is completed, the deposited films remain on the hot plate, thus improving the films' crystallinity. A Cu2ZnSnS4 solar cell is fabricated using entirely chemical synthesis methods. The
Kumar, YB KishoreYB, KiranTarigonda, HariprasadDoddipalli, Raghurami Reddy
This specification covers the requirements for brush plating of tin-zinc by electrodeposition.
AMS B Finishes Processes and Fluids Committee
Skoltech engineers have used a 3D printer to fabricate — and investigate the mechanical characteristics of — samples of bronze-steel alloys previously unknown to materials science. Blending the distinct properties of bronze and steel, the novel alloys could be used to manufacture combustion chambers for aircraft and rocket engines. These would benefit from both steel’s ability to withstand extreme temperatures and bronze’s capacity to conduct heat away from the chamber.
This SAE Aerospace Report (AIR) provides a cross reference for SAE material standards to other similar standards. The SAE Committee G-3 invites comments and recommendations for the addition of materials and information for inclusion into this informational report. No attempt has been made to obtain samples of the materials or conduct physical and chemical analyses to determine if they are equivalent. Anyone using this AIR, therefore, is cautioned to verify for themselves the interchangeabillity of the specific materials. Additional contributions of missing or supplemental data should be directed to SAE marked for the attention of Committee G-3.
G-3, Aerospace Couplings, Fittings, Hose, Tubing Assemblies
This specification covers one type of bronze in the form of round wire 0.500 inch (12.70 mm) and under in nominal diameter (see 8.5).
AMS D Nonferrous Alloys Committee
This standard defines the requirements for fully replacing undesirable surface finishes using robotic hot solder dip. Requirements for qualifying and testing the refinished piece parts are also included. This standard covers the replacement of pure tin and Pb-free tin alloy finishes with SnPb finishes with the intent of subsequent assembly with SnPb solder. This dipping is different from dipping to within some distance of the body for the purposes of solderability; solder dipping for purposes other than full replacement of pure tin and Pb-free tin alloy finishes are beyond the scope of this document. It covers process and testing requirements for robotic dipping process and does not cover semi-automatic or purely manual dipping processes. This standard does not apply to piece-part manufacturers who build piece parts with a hot solder dip finish. It applies to refinishing performed by a robotic hot solder dip service supplier or production facilities at the customer, whenever the intent
G-24 Pb-free Risk Management Committee for ADHP
This document provides risk mitigation for Pb-free solders used internal to parts used in Aerospace and Defense applications. It will include mitigations applicable to encapsulated and cavity devices as the needs arise in industry. Currently this revision only addresses devices with encapsulation or underfill. Mitigations for open cavity devices are still being discussed, and will be addressed in future revisions. Microbumps with Thermal Compression Bonding (TCB) are not addressed by the mitigations in this document. The use of Pb-free microbumps with TCB are considered out of scope at this time. It is expected that this document will be primarily used by Control Levels 3 and 2C (as defined in GEIA-STD-0005-2 for programs that do not allow use of Pb-free tin or only allow its use on an exception basis). It may be used by other levels, or by applications not using GEIA-STD-0005-2.
G-24 Pb-free Risk Management Committee for ADHP
This specification relates to Synchros, 60 and 400 Hz. It is not complete in itself, but shall be used in conjunction with MIL-DTL-81963, in which the latter shall be recognized as forming an inherent part of this specification. This standard requires a Qualified Products List (see 6.4).
AE-7A Generators and Controls Motors and Magnetic Devices
This standard defines the requirements for fully replacing undesirable surface finishes using robotic hot solder dip. Requirements for qualifying and testing the refinished piece parts are also included. This standard covers the replacement of pure tin and Pb-free tin alloy finishes with SnPb finishes with the intent of subsequent assembly with SnPb solder. This dipping is different from dipping to within some distance of the body for the purposes of solderability; solder dipping for purposes other than full replacement of pure tin and other Pb-free tin alloy finishes are beyond the scope of this document. It covers process and testing requirements for robotic dipping process and does not cover semi-automatic or purely manual dipping processes. This standard does not apply to piece-part manufacturers who build piece parts with a hot solder dip finish. It applies to refinishing performed by a robotic hot solder dip service supplier or production facilities at the customer, whenever the
G-24 Pb-free Risk Management Committee for ADHP
This standard outlines the conditions that enhance the risk of hydrogen embrittlement of steel and define the relief procedures required to minimize the risk of hydrogen embrittlement. It is intended to control the process.
USCAR
The intent of this ARP is to provide guidance to assist users in choosing compatible component finishes/platings to achieve the best corrosion resistance performance for compatible components/couples. This SAE Recommended Practice is intended as a guide toward standard practice and is subject to change to keep pace with experience and technical advances. A galvanic compatibility table is provided to assist with the compatible plating/finish selection. Specific plating performance parameters for each individual plating and each connector/accessory specification have also been provided to assist the product user with compatible plating/finish selection.
AE-8C1 Connectors Committee
This specification covers a cast tin bronze in the form of sealing rings.
AMS D Nonferrous Alloys Committee
This specification covers one type of bronze in the form of bars, rods, forgings, tubing, and forging stock.
AMS D Nonferrous Alloys Committee
This specification covers bearings of a tin alloy cast on one or both faces of a steel or bronze backing.
AMS D Nonferrous Alloys Committee
The bearing performance of steel backed half bearings, bushings, and washers is dependent on the properties and thickness of the lining alloy, the strength and dimensional stability of the steel backing (usually SAE 1010) and the strength of the bond between the lining alloy and the backing. This SAE Information Report is primarily concerned with the properties of the lining alloys used in automotive applications, in particular, the crankshaft bearings of the internal combustion engine.
Metals Technical Committee
For convenience, this SAE Information Report is presented in two parts as shown below. To avoid repetition, however, data applicable to both wrought and cast alloys is included only in Part 1. Part I—Wrought Copper and Copper Alloys Types of Copper (Table 1) General Characteristics (Table 3) Electrical Conductivity Thermal Conductivity General Mechanical Properties (Table 10) Yield Strength Fatigue Strength Physical Properties (Table 2) General Fabricating Properties (Table 3) Formability Bending Hot Forming Machinability Joining Surface Finishing Color Corrosion Resistance Effect of Temperature Typical Uses (Table 3) Part II—Cast Copper Alloys Types of Casting Alloys Effects of Alloy Elements and Impurities General Characteristics (Table 11) Physical Properties (Table 12) Typical Uses (Table 11)
Metals Technical Committee
This specification covers the requirements for preparation of aluminum and aluminum alloys for soldering by zinc immersion pre-treatment followed by copper plating and tin or tin-zinc alloy plating.
AMS B Finishes Processes and Fluids Committee
The intent of this ARP is to provide guidance to assist users in choosing compatible component finishes/platings to achieve the best corrosion resistance performance for compatible components/couples. This SAE Recommended Practice is intended as a guide toward standard practice and is subject to change to keep pace with experience and technical advances. A galvanic compatibililty table is provided to assist with the compatible plating/finish selection. Specific plating performance parameters for each individual plating and each connector/accessory specification have also been provided to assist the product user with compatible plating/finish selection.
AE-8C1 Connectors Committee
Tin sulfides (SnS and SnS2), represent a safer and greener alternative to other metal sulfides such as copper sulfides, and MoS2 etc. Their behavior is usually associated to that of solid lubricants such as graphite. A mixture of tin sulfides, with the 65 wt% of SnS2, has been characterized by scanning electron microscopy and by thermal gravimetric analysis (TGA). In order to investigate the effect of tin sulfides upon two crucial friction material ingredients, two mixtures were prepared: the former was made by mixing tin sulfides with a natural flake graphite and the latter was made mixing tin sulfides with a straight novolak. They were analyzed by TGA and differential thermal analysis (DTA) in both nitrogen and air. Some interferences were detected between tin sulfides and graphite in air. However, the oxidation of tin sulfides was concomitant with that of the novolak so that the resin onset decomposition-oxidation was considerably shifted to higher temperatures allowing the resin to
Dante, RobertoSliepcevich, AndreaAndreoni, MarcoCotilli, Mario
This document is intended for use as technical guidance by Aerospace system suppliers, e.g., Aerospace system Original Equipment Manufacturers (OEMs) and Aerospace system maintenance facilities, in developing and implementing designs and processes to assure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems (subsequently referred to as AHP) both during and after the transition to Pb-Free electronics. This document is intended for application to aerospace products; however, it may also be applied, at the discretion of the user, to other products with similar characteristics, e.g., low-volume, rugged use environments, high reliability, long lifetime, and reparability. If other industries wish to use this document, they may substitute the name of their industry for the word “Aerospace” in this document. The guidelines may be used by the OEMs and maintenance
G-24 Pb-free Risk Management Committee for ADHP
This standard defines the requirements for fully replacing undesirable surface finishes using robotic hot solder dip. Requirements for qualifying and testing the refinished piece parts are also included. This standard covers the replacement of pure tin and Pb-free tin alloy finishes with SnPb finishes with the intent of subsequent assembly with SnPb solder. This dipping is different from dipping to within some distance of the body for the purposes of solderability; solder dipping for purposes other than full replacement of pure tin and other Pb-free tin alloy finishes are beyond the scope of this document. It covers process and testing requirements for robotic dipping process and does not cover semi-automatic or purely manual dipping processes. This standard does not apply to piece-part manufacturers who build piece parts with a hot solder dip finish. It applies to refinishing performed by a robotic hot solder dip service supplier or production facilities at the customer, whenever the
G-24 Pb-free Risk Management Committee for ADHP
This handbook is designed to assist a program in assuring the performance, reliability, airworthiness, safety, and certifiability of product(s), in accordance with GEIA-STD-0005-1, “Performance Standard for Aerospace and High Performance Electronic Systems Containing Pb-free Solder”. Please note that the program manager, and managers of systems engineering, Supply Chain and Quality Assurance (along with their respective organizations), and the appropriate enterprise authority need to work together in ensuring that all impacts of Pb-free technology insertion are understood and risks mitigated accordingly. Herein “program management (or manager), supplier chain management (or manager), quality assurance management (or manager) and systems engineering management (or manager) and/or the appropriate enterprise authority” shall be defined as “responsible manager” throughout the remaining document (see Section 3, Terms and Definitions). The basic principles delineated in this handbook can be
G-24 Pb-free Risk Management Committee for ADHP
This document provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as SnPb or Pb-free alloys, or a combination of both solders and surface finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the technical structure to allow the repair technician to execute the task. This document focuses on the removal and replacement of piece parts. For the purposes of this document, the term “Rework/Repair” is used as applicable. NOTE: The information contained within this document is based on the current knowledge of the industry at the time of publication. Due to the rapid changing knowledge base, this document should be used for guidance only.
G-24 Pb-free Risk Management Committee for ADHP
This SAE Aerospace Information Report (AIR) shall be limited to general information about tin whisker formation on tin plated conductors. It summarizes the mechanisms of metal whisker formation and describes possible conclusions as related to tin plated conductors. It also provides a number of reference documents that describes research and observations of the whisker phenomena, recommendations to prevent its formation and conclusions. The investigation by this task group of AE-8D was initiated by a request of the Naval Air Warfare Center, Indianapolis, Indiana, to determine if the phenomenon of tin whiskers is a problem in aerospace wire and cable.
AE-8D Wire and Cable Committee
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