GEIASTD0006B Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts

Revised

04/01/2019

Features
Issuing Committee
Scope
Content
This standard defines the requirements for fully replacing undesirable surface finishes using robotic hot solder dip. Requirements for qualifying and testing the refinished piece parts are also included. This standard covers the replacement of pure tin and Pb-free tin alloy finishes with SnPb finishes with the intent of subsequent assembly with SnPb solder. This dipping is different from dipping to within some distance of the body for the purposes of solderability; solder dipping for purposes other than full replacement of pure tin and other Pb-free tin alloy finishes are beyond the scope of this document. It covers process and testing requirements for robotic dipping process and does not cover semi-automatic or purely manual dipping processes.
This standard does not apply to piece-part manufacturers who build piece parts with a hot solder dip finish. It applies to refinishing performed by a robotic hot solder dip service supplier or production facilities at the customer, whenever the intent of the dipping is to have full coverage and replacement of Pb-free tin. Replacement of BGA spheres or CGA columns is not included in the scope of this standard. IEC TS 62647-4 may be used for replacement of BGA spheres.
The intent of this standard is for suppliers and customers to incorporate these requirements into their operations to provide a consistent and well-controlled process for product applications that require significant control. Complete conversion of termination finishes from Pb-free to SnPb will allow use of piece parts for any of the Control Levels of GEIA-STD-0005-2 without mitigations. In addition to the elimination of tin whisker risks, piece parts processed to this standard will also exhibit enhanced solderability and solder joint reliability compared to most COTS finishes. Each customer shall determine the applicability of this standard and the need for full replacement of the existing termination finish. This standard does not guarantee a particular yield or reliability of piece parts going through solder dipping. Some applications may have unique requirements that exceed the scope of this standard and should be specified separately.
Pb-free tin piece parts which have been dipped in compliance with this standard are no longer considered to be Pb-free tin finished for the purposes of GEIA-STD-0005-2.
Rationale
Content
Revision necessary to adjust solder thickness requirements to accommodate smaller dimensional features common with terminations on typical Pb-free components, modify acoustic microscopy methods to better align with scope of inspection, prevent conflict with J-STD-033 by resetting cumulative bake time, and provide guidance on qualification category selection.
Meta TagsDetails
DOI
https://doi.org/10.4271/GEIASTD0006B
Pages
20
Citation
SAE International Information Report, Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts, SAE Standard GEIASTD0006B, Revised April 2019, Issued July 2008, https://doi.org/10.4271/GEIASTD0006B.
Additional Details
Publisher
Published
Apr 1, 2019
Product Code
GEIASTD0006B
Content Type
Information Report
Status
Revised
Language
English