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Requirements for Plastic Encapsulated Discrete Semiconductors in Space Applications

  • Aerospace Standard
  • AS6294/3
  • Current
Published 2019-08-07 by SAE International in United States
This content contains downloadable datasets
Annotation ability available
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Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder

  • Aerospace Standard
  • ARP6415
  • Current
Published 2019-07-23 by SAE International in United States
This content contains downloadable datasets
Annotation ability available

X-Ray Study of Low-Density Materials

  • Magazine Article
  • TBMG-33903
Published 2019-03-01 by Tech Briefs Media Group in United States

Additive Manufacturing Using Infrared and X-Ray Imaging

  • Magazine Article
  • TBMG-33892
Published 2019-03-01 by Tech Briefs Media Group in United States

Enhanced X-Ray Imaging Determines Molecular Structure

  • Magazine Article
  • TBMG-33585
Published 2019-01-01 by Tech Briefs Media Group in United States

COSMIC Impact: Next-Gen X-Ray Microscopy Platform

  • Magazine Article
  • TBMG-32878
Published 2018-09-01 by Tech Briefs Media Group in United States
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Requirements for Plastic Encapsulated Microcircuits in Space Applications

  • Aerospace Standard
  • AS6294/1
  • Current
Published 2017-11-21 by SAE International in United States
This content contains downloadable datasets
Annotation ability available

Custom Engineered HV Power Supplies for High- Performance Applications

  • Magazine Article
  • TBMG-27846
Published 2017-11-01 by Tech Briefs Media Group in United States
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Approval and Control of Premium-Quality Titanium Alloys

  • Aerospace Material Specification
  • AMS2380G
  • Current
Published 2017-06-16 by SAE International in United States
This content contains downloadable datasets
Annotation ability available

Reliability Assessment of CCGA 1752 Advanced Interconnect Kyocera Packages for Extreme Thermal Environments

  • Magazine Article
  • TBMG-24545
Published 2016-05-01 by Tech Briefs Media Group in United States