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Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace, and Other Rugged Applications
- Aerospace Standard
Published January 14, 2020 by SAE International in United States
Downloadable datasets availableAnnotation ability available
This Engineering Bulletin and its annexes provide guidance to Original Equipment Manufacturers (OEMs) in evaluating device manufacturer flows and in selecting cost effective, standard products that meet the performance objective for potential use in many rugged, military, space, extreme, or other environments.
This document is intended to provide guidance for Using Plastic Encapsulated Microcircuits and Semiconductors (PEMs) in Military, Aerospace, and other rugged applications. This document addesses the various qualification and monitoring testing of plastic encapsulated microcircuits and discrete semiconductors suitable for potential use in military and aerospace applications. The users can use this document to evaluate the potential suitability of a PEM product or the manufacturer for its intended application. SSB-1 Rev D has been updated from SSB-1 Rev C to take into account the comments from various CE-12 members. The changes from SSB-1 Rev C to SSB-1 Rev D are shown in Appendix A: (informative) Differences between SSB-1 Rev C and SSB-1 Rev D.
|Ground Vehicle Standard||GLOSSARY OF RELIABILITY TERMINOLOGY ASSOCIATED WITH AUTOMOTIVE ELECTRONICS|
|Aerospace Standard||Aerospace Series - Notice of Change (NOC) Requirements|
Data Sets - Support Documents
|Unnamed Dataset 1|
|Table 1||Standard temperature ranges|
|Unnamed Dataset 3|
|Table 2||Microcircuit reliability summary data example|
|Table 3||Semiconductor reliability summary data example|
|Table 4||Worst case use environments and appropriate accelerated testing for surface mount electronics by use categories example|
|Table 5||Example system requirements|
|Table 6||Failure rate estimate inputs (example)|
|Unnamed Dataset 9|
The CE-12 Solid State Devices Committee develops solutions to technical problems in the application, standardization, and reliability of solid state devices. This is implemented by evaluation and preparation of recommendations for specifications, standards, and other documents, both government and industry, to assure that solid state devices are suitable for their intended purposes.
|AIAG QS9000||This document is not part of the subscrption.|
|ANSI/EIA-599||This document is not part of the subscrption.|
|IPC-SM-785||This document is not part of the subscrption.|
|ISO 9000||This document is not part of the subscrption.|
|JESD47||This document is not part of the subscrption.|
|JESD69||This document is not part of the subscrption.|
|SSB1_001||Qualification and Reliability Monitors|
|SSB1_002||Environmental Tests and Associated Failure Mechanisms|
|SSB1_004||This document is not part of the subscrption.|
|STACK 0001||This document is not part of the subscrption.|
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