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Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications
- Aerospace Standard
- SSB1C
- Revised
Downloadable datasets available
Annotation ability available
Sector:
Issuing Committee:
Language:
English
Scope
This Engineering Bulletin and its annexes provide guidance to Original Equipment Manufacturers (OEMs) in evaluating device manufacturer flows and in selecting cost effective, standard products that meet the performance objective for potential use in many rugged, military, severe, or other environments.
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Data Sets - Support Documents
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Table 1 | Microcircuit Reliability Summary Data Example | |
Table 2 | Semiconductor Reliability Summary Data Example | |
Table 3 | Worst Case Use Environments and Appropriate Accelerated Testing for Surface Mount Electronics by Use Categories | |
Table 4 | System Requirements Example | |
Table 5 | Failure Rate Estimate Inputs |
Issuing Committee
The CE-12 Solid State Devices Committee develops solutions to technical problems in the application, standardization, and reliability of solid state devices. This is implemented by evaluation and preparation of recommendations for specifications, standards, and other documents, both government and industry, to assure that solid state devices are suitable for their intended purposes.
Reference
Number | Title |
---|---|
AIAG QS9000 | This document is not part of the subscrption. |
ANSI/EIA-599 | This document is not part of the subscrption. |
IPC-SM-785 | This document is not part of the subscrption. |
ISO 9000 | This document is not part of the subscrption. |
JESD47 | This document is not part of the subscrption. |
JESD69 | This document is not part of the subscrption. |
SSB1_001 | Qualification and Reliability Monitors |
SSB1_002 | Environmental Tests and Associated Failure Mechanisms |
SSB1_003A | Acceleration Factors |
SSB1_004 | This document is not part of the subscrption. |
STACK 0001 | This document is not part of the subscrption. |
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