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Environmental Tests and Associated Failure Mechanisms
- Aerospace Standard
Published September 12, 2014 by SAE International in United States
Downloadable datasets availableAnnotation ability available
This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications.
This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.
|Aerospace Standard||Qualification and Reliability Monitors|
|Aerospace Standard||Failure Rate Estimating|
Data Sets - Support Documents
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The CE-12 Solid State Devices Committee develops solutions to technical problems in the application, standardization, and reliability of solid state devices. This is implemented by evaluation and preparation of recommendations for specifications, standards, and other documents, both government and industry, to assure that solid state devices are suitable for their intended purposes.
|EIA J-STD-020||This document is not part of the subscrption.|
|EIA JESD-22-A113||This document is not part of the subscrption.|
|EIA659||This document is not part of the subscrption.|
|IPC/JEDEC J-STD-033||This document is not part of the subscrption.|
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