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Environmental Tests and Associated Failure Mechanisms
- Aerospace Standard
- SSB1_002
- Stabilized
Downloadable datasets available
Annotation ability available
Sector:
Issuing Committee:
Language:
English
Scope
This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications.
This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.
Recommended Content
| Aerospace Standard | Qualification and Reliability Monitors |
| Aerospace Standard | Failure Rate Estimating |
Topic
Data Sets - Support Documents
| Title | Description | Download |
|---|---|---|
| Unnamed Dataset 1 | ||
| Unnamed Dataset 2 | ||
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| Unnamed Dataset 4 | Environmental Tests and Associated Failure Mechanisms |
Issuing Committee
The CE-12 Solid State Devices Committee develops solutions to technical problems in the application, standardization, and reliability of solid state devices. This is implemented by evaluation and preparation of recommendations for specifications, standards, and other documents, both government and industry, to assure that solid state devices are suitable for their intended purposes.
Reference
| Number | Title |
|---|---|
| EIA J-STD-020 | This document is not part of the subscrption. |
| EIA JESD-22-A113 | This document is not part of the subscrption. |
| EIA659 | This document is not part of the subscrption. |
| IPC/JEDEC J-STD-033 | This document is not part of the subscrption. |
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