AMS3684C Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled

Stabilized

10/13/2016

Features
Issuing Committee
Scope
Content
This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.
Rationale
Content
This document has been determined to contain basic and stable technology which is not dynamic in nature.
Meta TagsDetails
DOI
https://doi.org/10.4271/AMS3684C
Pages
7
Citation
SAE International Material Specification, Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled, SAE Standard AMS3684C, Stabilized October 2016, Revised January 1993, Issued September 1975, https://doi.org/10.4271/AMS3684C.
Additional Details
Publisher
Published
Oct 13, 2016
Product Code
AMS3684C
Content Type
Material Specification
Status
Stabilized
Language
English

Revisions