AMS3684C Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled
Stabilized
10/13/2016
- Features
- Issuing Committee
- Content
- This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.
- Pages
- 7
- Citation
- SAE International Material Specification, Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled, SAE Standard AMS3684C, Stabilized October 2016, Revised January 1993, Issued September 1975, https://doi.org/10.4271/AMS3684C.