AMS3684 RESIN, POLYIMIDE, SEALING High Temperature Resistant, 315°C or 600°F Unfilled
Issued
09/01/1975
- Features
- Issuing Committee
- Content
- This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.
- Pages
- 1
- Citation
- SAE International Material Specification, RESIN, POLYIMIDE, SEALING High Temperature Resistant, 315°C or 600°F Unfilled, SAE Standard AMS3684, Issued September 1975, https://doi.org/10.4271/AMS3684.