Your Selections

Integrated circuits
Show Only

Collections

File Formats

Content Types

Dates

Sectors

Topics

Authors

Publishers

Affiliations

Committees

Events

Magazine

   This content is not included in your SAE MOBILUS subscription, or you are not logged in.

Advancements of MEMristor Materials in Neuromorphic Computing for Autonomous Systems.

Wayne State University-Kyle W. Brown
  • Technical Paper
  • 2020-01-0088
To be published on 2020-04-14 by SAE International in United States
The advancements in analog electronics has spurred the development of neuromorphic computing which can replicate bio-neurological processes using artificial synapses. Artificial synapses can process information faster and more efficiently than CPUs for specialized applications like sparse coding, graph searches, and constraint-satisfaction problems. Neuromorphic systems offset CPU’s lack of processing power to solve complex tasks and computations, higher parallelism, novel neural-inspired algorithms, and optimizations. Neural-inspired algorithms such as sparse coding, simultaneous localization and mapping (SLAM), path planning, and object tracking event-based cameras are necessary in development of autonomous systems. As the industry and academia realizes the limitations posed Moore’s Law, new computing and performance by MEMristors has enabled continued process-node scaling. New technology like Intel’s inspired neuromorphic microchip demonstrates the benefits of a specialized architecture for emerging applications, including some of the computational problems hardest for the internet of things (IoT) and autonomous devices to support. As new complex computing workloads grow the need for specialized architectures designed for specific applications will be in demand. Specialized architectures using specific applications are ideal for real-world applications, from…
   This content is not included in your SAE MOBILUS subscription, or you are not logged in.

Portable In-cylinder Pressure Measurement and Signal Processing System for Real-time Combustion Analysis and Engine Control

Southwest Research Institute-Yilun Luo, Siying Liu, Devon Adair
University of Michigan-Bryan Maldonado, Charles Solbrig, Anna Stefanopoulou
  • Technical Paper
  • 2020-01-1144
To be published on 2020-04-14 by SAE International in United States
To meet ever strict emissions regulations, cycle-to-cycle combustion control based on statistical processing and model-based prediction has attracted considerable attention from academia and industry. Feedback combustion control typically adjusts ignition-related parameters (spark advance, injection timing, cam timing, etc.) in a cycle-by-cycle manner based on the combustion characteristics measured from previous events. Cycle-to-cycle control guarantees a tight control at steady state and fast response during transients, enforcing an optimal combustion process over a wide variety of engine speed/load conditions. However, these control strategies are constrained by the combustion cycle duration, usually in the order of tens of milliseconds. Therefore, high-speed data acquisition and real-time processing is required. This paper describes a portable in-cylinder pressure measurement and processing system (P-BOT) that enables such a feedback control application to be used on an engine control unit (ECU). This system measures high-speed cylinder pressure signals and engine position, performs real-time heat release analysis, and sends the combustion results to the ECU for engine control at the end of each combustion event. This system is implemented on a Xilinx Zynq…

3D Printed Plastics with High-Performance Electrical Circuits

  • Magazine Article
  • TBMG-35771
Published 2020-01-01 by Tech Briefs Media Group in United States

Engineers have embedded high-performance electrical circuits inside 3D printed plastics, which could lead to better-performing biomedical implants. They used pulses of high-energy light to fuse tiny silver wires, resulting in circuits that conduct 10 times more electricity than the state of the art. By increasing conductivity tenfold, the engineers can reduce energy use, extend the life of devices. and increase the device’s performance.

   This content is not included in your SAE MOBILUS subscription, or you are not logged in.

Metallic Whiskers

AMS B Finishes Processes and Fluids Committee
  • Aerospace Standard
  • AIR4129A
  • Current
Published 2019-10-17 by SAE International in United States
This AIR presents an abbreviated review of the metallurgical phenomena known as whiskers. It is not all encompassing; rather, it is intended to introduce the design engineer to the technical issues of metallic whiskers, their formation, and the potentially dangerous problems they can cause.
Annotation ability available

Tiny “Walking” Motor Moves in Discrete Mechanical Steps

  • Magazine Article
  • TBMG-35261
Published 2019-10-01 by Tech Briefs Media Group in United States

A set of five tiny fundamental parts can be assembled into a wide variety of functional devices including a tiny “walking” motor that can move back and forth across a surface or turn the gears of a machine. The work offers an alternative to current approaches to constructing robots, which largely fall into one of two types: custom machines that work well but are relatively expensive and inflexible, and reconfigurable ones that sacrifice performance for versatility.

   This content is not included in your SAE MOBILUS subscription, or you are not logged in.

Requirements for Plastic Encapsulated Discrete Semiconductors in Space Applications

CE-12 Solid State Devices
  • Aerospace Standard
  • AS6294/3
  • Current
Published 2019-08-07 by SAE International in United States
This document establishes the requirements for screening, qualification, and lot acceptance testing of Plastic Encapsulated Discrete Semiconductors (PEDS) for use in space application environments. The scope of this document is intended for standard silicon based technology only, but the process and methodology described within can be adopted for other technologies such as Silicon Carbide, Gallium Nitride, and Gallium Arsenide. However, when non-silicon based technology parts are being used, the device characterization shall be modified, and it is recommended to use available industry standards based upon published research/testing reports for those technology to address applicable physics of failure.
This content contains downloadable datasets
Annotation ability available
   This content is not included in your SAE MOBILUS subscription, or you are not logged in.

Communication Transceivers Qualification Requirements - LIN

Vehicle Architecture For Data Communications Standards
  • Ground Vehicle Standard
  • J2962/1_201907
  • Current
Published 2019-07-18 by SAE International in United States
This document covers the requirements for transceiver qualification. Requirements stated in this document will provide a minimum standard level of performance for the LIN transceiver block in the IC to which all compatible transceivers shall be designed. No other features in the IC are tested or qualified as part of this recommended practice. This will assure robust serial data communication among all connected devices regardless of supplier. The goal of SAE J2962-1 is to commonize approval processes of LIN transceivers across OEMs. The intended audience includes, but is not limited to, LIN transceiver suppliers, component release engineers, and vehicle system engineers.
This content contains downloadable datasets
Annotation ability available
   This content is not included in your SAE MOBILUS subscription, or you are not logged in.

Communication Transceivers Qualification Requirements - CAN

Vehicle Architecture For Data Communications Standards
  • Ground Vehicle Standard
  • J2962/2_201907
  • Current
Published 2019-07-18 by SAE International in United States
This document covers the requirements for transceiver qualification. Requirements stated in this document will provide a minimum standard level of performance for the CAN transceiver in the IC to which all compatible transceivers shall be designed. No other features in the IC are tested or qualified as part of this recommended practice. This will assure robust serial data communication among all connected devices, regardless of supplier. The goal of SAE J2962-2 is to commonize approval processes of CAN transceivers across OEMs. The intended audience includes, but is not limited to, CAN transceiver suppliers, component release engineers, and vehicle system engineers.
This content contains downloadable datasets
Annotation ability available

Wafer-Level Microchannel Fabrication Process for Lab-on-a-Chip Devices

  • Magazine Article
  • TBMG-34761
Published 2019-07-01 by Tech Briefs Media Group in United States

Microchannels fabricated into a silicon-Pyrex wafer with a diameter of 75 m and total channel length of 40, 60, 80, or 100 mm — characterized by specialized microbeads within the channel — have been successfully created, tested, and used at NASA Goddard Space Flight Center. Designed to collect and separate amino acids towards finding the building blocks of life on other planets, this technology could be essential to many other lab-on-a-chip or microfluidic applications.

3D Printing of Flexible Circuits

  • Magazine Article
  • TBMG-34746
Published 2019-07-01 by Tech Briefs Media Group in United States

A process was developed for 3D printing that can be used to produce transparent and mechanically flexible electronic circuits. The electronics consist of a mesh of silver nanowires that can be printed in suspension and embedded in various flexible and transparent plastics (polymers). This technology can enable new applications such as printable light-emitting diodes, solar cells, or tools with integrated circuits. The approach integrates electronics into existing structural units and improves components in terms of space and weight.