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Snowmobii 2.0 (Snow mobility Unmanned Vehicle)

Harshil Patel
  • Technical Paper
  • 2019-28-2516
To be published on 2019-11-21 by SAE International in United States
In this paper we propose the snow mobility vehicle in order increase the mobility and decrease the risk of accidents for carry food and medicines on snow bounded areas using unmanned tracked vehicle called as snowmobii 2.0. Our unmanned tracked vehicle can transport Food/medicines as well as Defence in snow bounded areas. This unmanned robot can run in loose as well as hard snow due to it have specific featured technology in base wheel(track wheel system) such as hub with outer seals that improve its durability. The proposed snow mobility vehicle is consist of many sophisticated-designed systems such as navigation system, obstacle detection system, communication system, temperature sensing system. Snowmobii 2.0 is easy to get command and enable significant reduction in losses of many solder’s precious lives due to unavailability of food and medicines at that place. An unmanned tracked vehicle (snowmobii 2.0) is actively being developed for military use to perform various task like mobility on snow surface, carry food/medicines, defence etc.Predominantly this vehicle is used to replace human movement at hazardous place. It…
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Communication Transceivers Qualification Requirements - LIN

Vehicle Architecture For Data Communications Standards
  • Ground Vehicle Standard
  • J2962/1_201907
  • Current
Published 2019-07-18 by SAE International in United States

This document covers the requirements for transceiver qualification. Requirements stated in this document will provide a minimum standard level of performance for the LIN transceiver block in the IC to which all compatible transceivers shall be designed. No other features in the IC are tested or qualified as part of this recommended practice. This will assure robust serial data communication among all connected devices regardless of supplier.

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Communication Transceivers Qualification Requirements - CAN

Vehicle Architecture For Data Communications Standards
  • Ground Vehicle Standard
  • J2962/2_201907
  • Current
Published 2019-07-18 by SAE International in United States

This document covers the requirements for transceiver qualification. Requirements stated in this document will provide a minimum standard level of performance for the CAN transceiver in the IC to which all compatible transceivers shall be designed. No other features in the IC are tested or qualified as part of this recommended practice. This will assure robust serial data communication among all connected devices, regardless of supplier.

Wafer-Level Microchannel Fabrication Process for Lab-on-a-Chip Devices

  • Magazine Article
  • TBMG-34761
Published 2019-07-01 by Tech Briefs Media Group in United States

Microchannels fabricated into a silicon-Pyrex wafer with a diameter of 75 m and total channel length of 40, 60, 80, or 100 mm — characterized by specialized microbeads within the channel — have been successfully created, tested, and used at NASA Goddard Space Flight Center. Designed to collect and separate amino acids towards finding the building blocks of life on other planets, this technology could be essential to many other lab-on-a-chip or microfluidic applications.

3D Printing of Flexible Circuits

  • Magazine Article
  • TBMG-34746
Published 2019-07-01 by Tech Briefs Media Group in United States

A process was developed for 3D printing that can be used to produce transparent and mechanically flexible electronic circuits. The electronics consist of a mesh of silver nanowires that can be printed in suspension and embedded in various flexible and transparent plastics (polymers). This technology can enable new applications such as printable light-emitting diodes, solar cells, or tools with integrated circuits. The approach integrates electronics into existing structural units and improves components in terms of space and weight.

Safety Analysis: The Key to a Single-Pass ISO26262 Random Fault Workflow

  • Magazine Article
  • TBMG-34629
Published 2019-06-01 by Tech Briefs Media Group in United States

Advanced driver-assistance systems and autonomous drive technologies increase the complexity of automotive integrated circuits (ICs), making it harder to ensure that ICs are protected from random hardware faults. Safety mechanisms must be inserted to identify and control these unpredictable functional failures, and ISO26262 requires that the effectiveness of every safety mechanism is proven.

Programming Light on a Chip

  • Magazine Article
  • TBMG-34606
Published 2019-06-01 by Tech Briefs Media Group in United States

Microwave signals are ubiquitous in wireless communications but interact too weakly with photons. A technique was developed to fabricate high-performance optical microstructures using lithium niobate, a material with powerful electro-optic properties. The new integrated photonics platform can store light and electrically control its frequency (or color) in an integrated circuit. The platform draws inspiration from atomic systems and could have a wide range of applications including photonic quantum information processing, optical signal processing, and microwave photonics.

Ultra-Low-Power Chips Enhance Performance of Small Robots

  • Magazine Article
  • TBMG-34575
Published 2019-06-01 by Tech Briefs Media Group in United States

An ultra-low-power hybrid chip inspired by the brain could help give palm-sized robots the ability to collaborate and learn from their experiences. Combined with new generations of low-power motors and sensors, the new application-specific integrated circuit (ASIC), which operates on milliwatts of power, could help intelligent swarm robots operate for hours instead of minutes.

Waterproof Graphene Electronic Circuits

  • Magazine Article
  • TBMG-34387
Published 2019-05-01 by Tech Briefs Media Group in United States

The many applications of graphene, an atomically-thin sheet of carbon atoms with extraordinary conductivity and mechanical properties, include the manufacture of sensors. These transform environmental parameters into electrical signals that can be processed and measured with a computer. Due to their two-dimensional structure, graphene-based sensors are extremely sensitive and promise good performance at low manufacturing cost.

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High Resolution LiDAR Based on Single Chip SPAD Array

DENSO Corporation-Takehiro Hata, Noriyuki Ozaki, Yoshihiro Murakami, Kenta Azuma, Shinji Kashiwada, Kenichi Yanai
Published 2019-04-02 by SAE International in United States
It is important that Advanced Driver Assistance Systems (ADAS) and Automated Driving Systems (AD) detect on-road objects, road vehicles and pedestrians. The typical detection devices mounted on ADAS and AD include a camera, a millimeter-wave radar and a Light Detection And Ranging (LiDAR). Since LiDAR can obtain accurate distance and fine spatial resolution due to its short wavelength, it is expected that small objects such as a tire can be detected. However, the conventional LiDAR is equipped with multiple light transmitters and light receivers such as avalanche photo diodes. This causes LiDAR system to be expensive and large in size. Aiming to reduce the cost and size of LiDAR, we employed Single-Photon Avalanche Diode (SPAD) which can be fabricated by CMOS process and easily arrayed. We also developed “Single Chip SPAD Array“ in which the two-dimensional array of SPAD and a signal processing block of range calculation were integrated into a single chip. The light-receiving area was composed of 260x12 SPAD-pixels array. In order to verify the principles, we designed a prototype of LiDAR on…
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