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Acceleration Factors
- Aerospace Standard
- SSB1_003A
- Stabilized
Downloadable datasets available
Annotation ability available
Sector:
Issuing Committee:
Language:
English
Scope
This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision).
This document provides reference information concerning acceleration factors commonly used by device manufacturers to model failure rates in conjunction with statistical reliability monitoring. These acceleration factors are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use applications.
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Topic
Data Sets - Support Documents
| Title | Description | Download |
|---|---|---|
| Unnamed Dataset 1 | ||
| Unnamed Dataset 2 | ||
| Unnamed Dataset 3 | ||
| Unnamed Dataset 4 | ||
| Table 3-1 | Failure Mechanisms & Activation Energies | |
| Table 4-1 | Cyclical Bias Criteria | |
| Table 5-1 | Failure Mechanisms & Coffin-Manson Exponent Ranges | |
| Table 5-2 | Coffin-Manson Exponents | |
| Unnamed Dataset 9 |
Issuing Committee
The CE-12 Solid State Devices Committee develops solutions to technical problems in the application, standardization, and reliability of solid state devices. This is implemented by evaluation and preparation of recommendations for specifications, standards, and other documents, both government and industry, to assure that solid state devices are suitable for their intended purposes.
Reference
| Number | Title |
|---|---|
| EIA JEP-122 | This document is not part of the subscrption. |
| EIA JESD-22-A104 | This document is not part of the subscrption. |
| EIA JESD-22-A110 | This document is not part of the subscrption. |
| EIA JESD-47 | This document is not part of the subscrption. |
| IPC-SM-785 | This document is not part of the subscrption. |
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