SSB1_003A: Acceleration Factors - Information Report

Features

Issuing Committee: CE-12 Solid State Devices

Scope

Content: This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision).

This document provides reference information concerning acceleration factors commonly used by device manufacturers to model failure rates in conjunction with statistical reliability monitoring. These acceleration factors are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use applications.

Meta Tags

Topics: Joining
Humidity
Scale models
Aluminum alloys
Integrated circuits
Semiconductor devices
Fatigue
Alloys
Vehicle acceleration

Details

DOI: https://doi.org/10.4271/SSB1_003A

Pages: 25

Citation: SAE International Information Report, Acceleration Factors, SAE Standard SSB1_003A, Stabilized September 2014, Revised October 2002, https://doi.org/10.4271/SSB1_003A.

Additional Details

Publisher: SAE International

Published: Sep 12, 2014

Product Code: SSB1_003A

Content Type: Information Report

Status: Stabilized

Language: English