J1752/2_200301 Measurement of Radiated Emissions from Integrated Circuits—Surface Scan Method (Loop Probe Method) 10 MHz to 3 GHz

Revised

01/21/2003

Features
Issuing Committee
Scope
Content
This SAE Recommended Practice defines a method for evaluating the near field electric or magnetic component of the electromagnetic field at the surface of an integrated circuit (IC). This technique is capable of providing a detailed pattern of the RF sources internal to the IC. The resolution of the pattern is determined by the characteristics of the probes used and the precision of the mechanical probe positioner. The method is usable over the 10 MHz to 3 GHz frequency range with existing probe technology. The probe is mechanically scanned according to a programmed pattern in a plane parallel or perpendicular to the IC surface and the data is computer processed to provide a color-enhanced representation of field strength at the scan frequency. This procedure is applicable to measurements from an IC mounted on any circuit board that is accessible to the scan probe. For comparisons, the standardized test board shall be used. This diagnostic procedure is intended for IC architectural analysis including functional floor plan and power distribution.
Meta TagsDetails
DOI
https://doi.org/10.4271/J1752/2_200301
Pages
10
Citation
SAE International Recommended Practice, Measurement of Radiated Emissions from Integrated Circuits—Surface Scan Method (Loop Probe Method) 10 MHz to 3 GHz, SAE Standard J1752/2_200301, Revised January 2003, Issued March 1995, https://doi.org/10.4271/J1752/2_200301.
Additional Details
Publisher
Published
Jan 21, 2003
Product Code
J1752/2_200301
Content Type
Recommended Practice
Status
Revised
Language
English