ARP6415: Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder - Recommended Practice

Features

Issuing Committee: G-24 Pb-free Risk Management Committee for ADHP

Scope

Content: This document contains information and guidance on the use of Pb-free ball grid arrays (BGAs) in an aerospace, defense, and high performance (ADHP) product, or other products which demand a high reliability.

Meta Tags

Topics: Assembling
Joining
Production control
Identification numbers
X-ray inspections
Coatings, colorants, and finishes
Fatigue
Packaging

Details

DOI: https://doi.org/10.4271/ARP6415

Pages: 32

Citation: SAE International Recommended Practice, Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder, SAE Standard ARP6415, Issued July 2019, https://doi.org/10.4271/ARP6415.

Additional Details

Publisher: SAE International

Published: Jul 23, 2019

Product Code: ARP6415

Content Type: Recommended Practice

Status: Issued

Language: English