AMS3731/10C: POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible - Material Specification

Features

Issuing Committee: AMS P Polymeric Materials Committee

Scope

Content: This specification covers an unfilled, room-temperature-polymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system.

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Details

DOI: https://doi.org/10.4271/AMS3731/10C

Citation: SAE International Material Specification, POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible, SAE Standard AMS3731/10C, Stabilized November 2017, Noncurrent January 1993, Revised October 1987, Issued October 1981, https://doi.org/10.4271/AMS3731/10C.

Additional Details

Publisher: SAE International

Published: 11/29/2017

Product Code: AMS3731/10C

Content Type: Material Specification

Status: Stabilized

Language: English

AMS3731/10C

Historical

AMS3731/10B

AMS3731/10A