AIR1141: 1992 Report on Flip Chip and Beam Lead Bonding for Electronic Circuits - Information Report

Issuing Committee: AE-7P Protective and Control Devices

Scope

Content: No Scope available

Meta Tags

Topics: Electrical systems
Electronic equipment

Details

DOI: https://doi.org/10.4271/AIR1141

Citation: SAE International Information Report, 1992 Report on Flip Chip and Beam Lead Bonding for Electronic Circuits, SAE Standard AIR1141, Cancelled December 1971, https://doi.org/10.4271/AIR1141.

Additional Details

Publisher: SAE International

Published: 12/1/1971

Product Code: AIR1141

Content Type: Information Report

Status: Canceled

Language: English