Ultra-Slim Automotive Acceleration Sensor Applied MEMS Technology

We have developed a new wafer process for manufacturing micro-structures using Micro Electrical Mechanical Systems (MEMS) technology. Our process combines a single-crystal SOI wafer, vertical Si etching, and back side anisotropic-etching by KOH, and dry release by the plasma etching of SiO₂. The sticking of movable structures cannot occur in our process, because no wet treatment is used for release. Our process needs only 4-masks, therefore, it is suitable for mass-production. We have developed ultra-slim acceleration sensor using this process.