The work presented here was developed within the scope of the Tire-Tooling Benchmark Project – Mover – FUNDEP – Line IV – in response to demands from the tire manufacturing sector for solutions to monitor tire molds. This study presented the development and validation of an embedded device that integrates RFID technology, wireless communication (LoRa and Wi-Fi), and local processing via an ESP32 microcontroller. The system was capable of collecting and processing data related to mold lifecycle, such as usage cycles, inspections, and maintenance activities, enabling predictive maintenance strategies. A functional prototype was successfully built and tested, validating reliable cycle readings, stable communication with a remote database, and consistent embedded logic. Based on these results, a custom Printed Circuit Board (PCB) was designed, focusing on robustness, compactness, and industrial applicability. Although the PCB has not yet been fabricated or tested in the production environment, the project lays a solid foundation for the next steps, such as field validation and improvements to the digital ecosystem - including the interactive dashboard and future integration with industrial platforms.