Through-Thickness Thermal Conductivity in Composites Based on 3-D Fiber Architectures

2007-01-3931

9/17/2007

Authors
Abstract
Content
The use of highly thermally conductive fibers can improve the in-plane heat flow of structural composites based on unidirectional tapes or 2-D laminates with little effect on the heat flow out-of-plane. One method of achieving significant increase in the through-thickness thermal conductivity is to manufacture composites based on 3-D fiber architectures with high thermal conductivity fibers in the through-thickness direction. To demonstrate the effectiveness of this method, orthogonal 3-D woven preforms with pitch carbon tows and with copper tows in the through-thickness direction were manufactured and infused with epoxy resin. Test samples from these composites achieved 4 - 7.2 W/mK in the through-thickness direction.
Meta TagsDetails
DOI
https://doi.org/10.4271/2007-01-3931
Pages
7
Citation
Sharp, K., Bogdanovich, A., Schuster, J., and Heider, D., "Through-Thickness Thermal Conductivity in Composites Based on 3-D Fiber Architectures," SAE Technical Paper 2007-01-3931, 2007, https://doi.org/10.4271/2007-01-3931.
Additional Details
Publisher
Published
9/17/2007
Product Code
2007-01-3931
Content Type
Technical Paper
Language
English