Thermal Physics of Failure

961266

05/01/1996

Event
Reliability, Maintainability, Supportability & Logistics (Rmsl) Conference & Workshop
Authors Abstract
Content
Temperature changes cause thermo-mechanical stresses and creep in solder joints of electronics. These conditions induce cracking in the solder and eventual failure of the electronic component. This paper describes procedures for predicting the lifetime to failure of electronics exposed to thermal cycling.
Meta TagsDetails
DOI
https://doi.org/10.4271/961266
Pages
5
Citation
Perez, R., "Thermal Physics of Failure," SAE Technical Paper 961266, 1996, https://doi.org/10.4271/961266.
Additional Details
Publisher
Published
May 1, 1996
Product Code
961266
Content Type
Technical Paper
Language
English