Thermal Interface Materials Based on Anchored Carbon Nanotubes

2007-01-3127

07/09/2007

Authors
Abstract
Content
The new devices and missions to achieve the aims of NASA's Science Mission Directorate (SMD) are creating increasingly demanding thermal environments and applications. In particular, the low conductance of metal-to-metal interfaces used in the thermal switches lengthen the cool-down phase and resource usage for spacecraft instruments. During this work, we developed and tested a vacuum-compatible, durable, heat-conduction interface that employs carbon nanotube (CNT) arrays directly anchored on the mating metal surfaces via microwave plasma-enhanced, chemical vapor deposition (PECVD). We demonstrated that CNT-based thermal interface materials have the potential to exceed the performance of currently available options for thermal switches and other applications.
Meta TagsDetails
DOI
https://doi.org/10.4271/2007-01-3127
Pages
8
Citation
Rozzi, J., Kaszeta, R., and Fisher, T., "Thermal Interface Materials Based on Anchored Carbon Nanotubes," SAE Technical Paper 2007-01-3127, 2007, https://doi.org/10.4271/2007-01-3127.
Additional Details
Publisher
Published
Jul 9, 2007
Product Code
2007-01-3127
Content Type
Technical Paper
Language
English