Thermal Design of Standard Avionic Enclosures

820878

02/01/1982

Event
Intersociety Conference on Environmental Systems
Authors Abstract
Content
This paper details the development of standardized avionic enclosures for Naval aircraft, with particular emphasis on the package’s thermal design. The packaging system is unique in that it can accommodate modules of two different standardized sizes (ISEM-2A and 1/2 ATR), and modules having three different cooling modes -conduction cooled, flow-through cooled, and heat pipe cooled. The three module cooling modes, together with required package dissipation rates of 125 watts/MCU and pressure drops below 2.8 mm mercury create a great deal of complexity in the optimization of the thermal system. A computerized optimization program was therefore utilized to achieve specific designs, with results reported for various module mixes and heat exchanger designs.
Meta TagsDetails
DOI
https://doi.org/10.4271/820878
Pages
11
Citation
Franklin, J., and Kramer, T., "Thermal Design of Standard Avionic Enclosures," SAE Technical Paper 820878, 1982, https://doi.org/10.4271/820878.
Additional Details
Publisher
Published
Feb 1, 1982
Product Code
820878
Content Type
Technical Paper
Language
English