Thermal Accommodation of Attached Pressurized Module Payloads

941570

06/01/1994

Authors
Abstract
Content
The backbone of the Attached Pressurized Module (APM) is the water cooling loop, which contributes to an optimized payload operation. Dedicated design means are proposed to allow an efficient use of this resource.
In case of a Thermal Control System (TCS) failure a controlled run-down of individual payloads is possible to avoid critical situations like overheating due to heat soak back from a furnace. The TCS is flexible enough to allow short payload power peaks thus optimizing the resource allocation without violation of the thermal requirements regarding the temperature limits.
The APM will be verified against generic thermal and environmental control requirements. The test and analytical verification effort on payload side is dependant whether the payload is a facility integrated in an International Standard Payload Rack (ISPR) or a smaller entity like a drawer as subset of a facility or a self-standing experiment.
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DOI
https://doi.org/10.4271/941570
Pages
9
Citation
Laux, U., Behrens, B., Gargioli, E., and Gastaldi, C., "Thermal Accommodation of Attached Pressurized Module Payloads," SAE Technical Paper 941570, 1994, https://doi.org/10.4271/941570.
Additional Details
Publisher
Published
Jun 1, 1994
Product Code
941570
Content Type
Technical Paper
Language
English