Super-slim 2 Axes Automotive Accelerometer Using MEMS Technology

2009-01-0636

04/20/2009

Event
SAE World Congress & Exhibition
Authors Abstract
Content
We have developed a novel wafer process for capacitive sensing accelerometer using surface Micro Electrical Mechanical Systems (MEMS) technology and successfully applied to the fabrication process. Our new process combines with a single crystal SOI (Si on Insulator) wafer, high aspect ratio silicon etching and newly developed anhydrous HF/Alcohol etch process of silicon oxides. Although wet conditions such as HF/water etch occurs stiction of mobile structure, our anhydrous HF/Alcohol etch process technology occurs no stiction of mobile structures, because of gas phase (dry) process. In our process, we have achieved smaller-sized sensor chip compared to our conventional 2 axes accelerometer.
Meta TagsDetails
DOI
https://doi.org/10.4271/2009-01-0636
Pages
6
Citation
Yokoyama, K., Furuichi, T., and Yokura, H., "Super-slim 2 Axes Automotive Accelerometer Using MEMS Technology," SAE Technical Paper 2009-01-0636, 2009, https://doi.org/10.4271/2009-01-0636.
Additional Details
Publisher
Published
Apr 20, 2009
Product Code
2009-01-0636
Content Type
Technical Paper
Language
English