Study of Mount Technology on Alumina Multilayer Substrate for Automatic Transmission ECU

2003-01-0620

03/03/2003

Event
SAE 2003 World Congress & Exhibition
Authors Abstract
Content
Reliability of electronic components assembly mounting technologies used on multilayer alumina substrates has been investigated for Electronic Control Units (ECU's), specifically for use in harsh locations, such as under the hood or directly attached to the transmissions of automobiles. The technology mainly consists of lead-free solder and bare chip assembly. Reliability evaluation tests have been performed in a practical, severe environment, similar to under the hood of automobiles. The experiments mainly consist of thermal cycling and corrosion tests. Computer simulation techniques have also been conducted in order to obtain accurate prediction of product lifetime. The estimated lifetimes of the lead-free solders agree fairly well with the experimental results. Through these studies, ECU's with higher reliability have been applied to automatic transmissions of commercial passenger vehicles.
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DOI
https://doi.org/10.4271/2003-01-0620
Pages
8
Citation
Odonari, K., Nakagawa, S., Matsumoto, H., Kaji, M. et al., "Study of Mount Technology on Alumina Multilayer Substrate for Automatic Transmission ECU," SAE Technical Paper 2003-01-0620, 2003, https://doi.org/10.4271/2003-01-0620.
Additional Details
Publisher
Published
Mar 3, 2003
Product Code
2003-01-0620
Content Type
Technical Paper
Language
English