Strength Analysis of the Induction Spot and Full Bonding Processes

When utilizing induction heating for curing adhesives to obtain quick handling strength, heating the complete bond line is the accepted and proven process. Challenging this process is the induction spot curing (partial cure of the bond line) process. This paper will analyze the strength of the induction spot curing process, and compare it to the strength attained when we induction cure the entire bond line. Both one and two component adhesives, as well as metal and plastic substrates, will be examined. Examples and application advantages of both processes will also be presented.