Spray Cooling of a High Power Laser Diode

In laser diodes arrays, integrated circuits mounted together on a single substrate to form one level package allow higher laser intensities, varied frequencies at enormous size and weight savings. However, with the denser packaging and higher intensities is introduced a higher heat dissipation. Under conditions of high-heat-flux the temperatures and thermal gradients within the laser device can become considerable. This effort illustrates that by spray cooling the laser diode not only can the optical efficiency (increased by 33%) and power input (increased by 75%) be increased significantly but also the laser package can be reduced in size by a factor of ten or more.