Silicone Thermal Interface Materials For Automotive Electronics

2007-01-2962

11/28/2007

Event
SAE Brasil 2007 Congress and Exhibit
Authors Abstract
Content
Today one of the key issues facing electronic systems designs is heat dissipation. This is even more critical in Automotive Electronics because smaller and lighter modules coupled with higher component density lead to increased necessity of thermal power dissipation. Electronic modules with greater functionality and power also generate more heat. Higher temperatures can directly affect the performance and reliability of these modules. The unique properties of silicone thermal interface materials - in the form of adhesives, gels, encapsulants, gap fillers and thermal pads - can help automotive engineers get increased heat dissipation with higher levels of flexibility and better physical and electrical performance.
Meta TagsDetails
DOI
https://doi.org/10.4271/2007-01-2962
Pages
10
Citation
Nascimento, L., Debastiani, E., and Stephan, M., "Silicone Thermal Interface Materials For Automotive Electronics," SAE Technical Paper 2007-01-2962, 2007, https://doi.org/10.4271/2007-01-2962.
Additional Details
Publisher
Published
Nov 28, 2007
Product Code
2007-01-2962
Content Type
Technical Paper
Language
English