Sensor-controlled Friction Materials based on Liquid Friction Compounds, Chip-in-Pad Concept

In this paper, the concept of integrating thin-film piezo transducers into friction pads by using a liquid friction material compound (LIQFRIC® HP), which is capable of completely embedding the sensor surface and allowing for the force transfer due to a direct contact between sensor and friction material, is explained. The low thickness of the sensor allows for an excellent ratio of sensor volume / friction volume in the pad. The piezo transducer, besides being able to detect positive and negative pressure changes, can also be used via its EMI capability to allow measurements of changes in the shape (and therefore thickness) of the pad during and after testing. Measuring the pressure distribution, the wear and possible defect situations of the pad potentially opens up new means of friction pad- and brake operations or developments.