Residual Stresses in Thin Films and Modified Surfaces Measured by Two-dimensional XRD with Low Incident Angle

The stress measurement with two-dimensional x-ray diffraction (XRD²) can be done with low incident angle and is not limited to the peaks with high two-theta angles like the conventional method. When residual stresses of thin films or modified surfaces are measured, a low incident angle is required to maximize the diffraction signals from the thin films or modified surfaces instead of from the substrates and matrix materials. Several experimental examples are used to describe the stress measurement method including titania layer generated by micro-arc oxidation of titanium and magnetron sputter-deposited Cu films.