OCP - Materials

2001-01-1022

03/05/2001

Event
SAE 2001 World Congress
Authors Abstract
Content
Outokumpu Copper Strip AB has developed Copper alloys for use in heat exchanger applications where high temperature joining is employed. The alloys are basically low alloyed Copper and Brass. These alloys are particularly suitable for the brazing of Copper and Brass heat exchangers. For joining purposes an alloy has been developed as brazing filler material. That alloy has properties that give high strength at comparatively low brazing temperatures. All these alloys are being used in the CuproBraze process of manufacturing copper and brass heat exchangers. This paper will explain the properties of these materials and their use.
Meta TagsDetails
DOI
https://doi.org/10.4271/2001-01-1022
Pages
8
Citation
Falkenö, A., and Ainali, M., "OCP - Materials," SAE Technical Paper 2001-01-1022, 2001, https://doi.org/10.4271/2001-01-1022.
Additional Details
Publisher
Published
Mar 5, 2001
Product Code
2001-01-1022
Content Type
Technical Paper
Language
English