New Design of Ultra High Cell Density Metal Substrates

2002-01-0353

03/04/2002

Event
SAE 2002 World Congress & Exhibition
Authors Abstract
Content
To meet the most stringent emissions standards such as Super Ultra Low Emission Vehicle (SULEV) in California, substrates with high cell densities and ultra thin foils are needed, mounted in a close-coupled position. A new substrate design has been developed incorporating increased thermal and mechanical load in association with reduced thermal mass and improved heat transfer due to higher cell density. This paper describes the development of the new design using finite element calculation and practical test results from component and engine test benches.
Meta TagsDetails
DOI
https://doi.org/10.4271/2002-01-0353
Pages
12
Citation
Schaper, K., Brück, R., Konieczny, R., Dietsche, A. et al., "New Design of Ultra High Cell Density Metal Substrates," SAE Technical Paper 2002-01-0353, 2002, https://doi.org/10.4271/2002-01-0353.
Additional Details
Publisher
Published
Mar 4, 2002
Product Code
2002-01-0353
Content Type
Technical Paper
Language
English