New Accelerometer Based on Innovative Packaging and Circuit Design

951018

02/01/1995

Event
International Congress & Exposition
Authors Abstract
Content
A signal-conditioned accelerometer is described which offers many advantages to the user. The sensor element, manufactured using silicon micromachining, has proven reliability. The signal conditioning does not require external components and thick or thin film technology but is done entirely within a monolithic IC. The sensor and signal conditioning chips are hermetically packaged together in a ceramic leadless chip carrier. The output parameters are trimmed electrically after packaging is completed. The chip carrier can be mounted in several orientations to allow measurement of acceleration either perpendicular to or in plane with the mounting surface.
Meta TagsDetails
DOI
https://doi.org/10.4271/951018
Pages
7
Citation
de Bruin, D., and Dunbar, M., "New Accelerometer Based on Innovative Packaging and Circuit Design," SAE Technical Paper 951018, 1995, https://doi.org/10.4271/951018.
Additional Details
Publisher
Published
Feb 1, 1995
Product Code
951018
Content Type
Technical Paper
Language
English