Multi-Physics Simulation and Reliability Analysis of Onboard EV Charger

The rapid advancement of electric vehicle (EV) technology has created a demand for reliable and Thermal - efficient electronic components for power electronics and control systems on printed circuit boards (PCBs). The research looks at the overall simulation and study of a PCB for Electric Vehicles, including how it handles heat, stress, and reliability in real working conditions like considering casing (Heat Sink) in which PCB is held, into the simulation. We have used numerical based methods (reliability), Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) methods to simulate heat performance looking at steady-state and changing load profiles common in EV powertrains. We ran structural and thermal simulations to check the PCB's toughness against heat expansion and shaking loads often seen in cars. We also did a reliability check looking at heat cycling life for PCB components, and possible ways it could break to guess long-term toughness. The results show critical hot spots in the PCB design, structure warping from mechanical stress, and highlighted key things that affect how long the PCB components can lasts. Based on these simulations, we suggested some ways to manage heat, and structural rigidity, like selecting better materials and placing parts at smarter location. This study shows a step-by-step way to use multi-physics simulations early when designing EV PCBs leading to better heat control mechanical toughness, and overall system reliability. A framework has been created to conduct the Thermal, Structural analysis and on basis of these results reliability of the electronics system is performed.