Modeling and Analysis of MEMS in Multi-Physics Fields

2007-01-0404

04/16/2007

Event
SAE World Congress & Exhibition
Authors Abstract
Content
An analytical model and a numerical procedure to simulate coupled energy domains in capacitive microdevices are presented. The model consists of a flexible microplate under the effect of electrostatic forces and squeeze film damping. The coupled system is described by the linear plate equation and a modified compressible Reynolds equation to account for the rarefied gas in the narrow gap between the microplate and substrate. A numerical method based on Differential Quadrature Method (DQM) is employed to discretize and solve the coupled differential equations of motion for complex eigenvalues, mode shapes, and quality factors. The simulation results are compared to the experimental data available in the literature. The analysis highlights the effect of air pressure on quality factors and natural frequencies of the coupled system. The developed model provides an effective analysis tool that can be applied to a large class of capacitive devices employing resonant microplates and microbeams.
Meta TagsDetails
DOI
https://doi.org/10.4271/2007-01-0404
Pages
11
Citation
Beloiu, D., "Modeling and Analysis of MEMS in Multi-Physics Fields," SAE Technical Paper 2007-01-0404, 2007, https://doi.org/10.4271/2007-01-0404.
Additional Details
Publisher
Published
Apr 16, 2007
Product Code
2007-01-0404
Content Type
Technical Paper
Language
English