Minimizing Cost of Material Variances in Printed Circuit Board Assembly

2007-01-0781

04/16/2007

Event
SAE World Congress & Exhibition
Authors Abstract
Content
Controlling the Cost of Variance is essential to the manufacturing process of Printed Circuit Board Assembly for low volume high mix production. The material variance is identified as the additional components and resources consumed beyond the minimum required to complete the project. This Quantity Variance occurs at the effects of defects at key steps of the manufacturing process. Such occurrences result in the need to purchase additional components for the completion of the order. These additional components termed Quantity Variance alter the sequence of the manufacturing process affecting quality, timely delivery of the job and directly impacting company profitability.
Meta TagsDetails
DOI
https://doi.org/10.4271/2007-01-0781
Pages
10
Citation
Gebara, N., Jawad, B., and Szymanski, P., "Minimizing Cost of Material Variances in Printed Circuit Board Assembly," SAE Technical Paper 2007-01-0781, 2007, https://doi.org/10.4271/2007-01-0781.
Additional Details
Publisher
Published
Apr 16, 2007
Product Code
2007-01-0781
Content Type
Technical Paper
Language
English