Micromechanics Modeling of Automotive Instrument Panels
870199
2/1/1987
- Content
- The tensile modulus, fiber orientation distribution and fiber orientation angle in selected regions of an automotive upper instrument panel (IP) were examined for correlation with predicted modulus. A first molding trial of the IP was compared to the results of a second trial which incorporated several engineering changes. As expected, the fiber orientation varied within the panel as well as between molding trials. A micromechanics model was utilized to predict modulus as a function of the measured fiber orientation. These predictions were compared with experimental values for each region and molding trial. Excellent agreement between predicted and measured values was observed.
- Citation
- Bozarth, M., "Micromechanics Modeling of Automotive Instrument Panels," SAE International Congress and Exposition, Detroit, Michigan, United States, February 23, 1987, https://doi.org/10.4271/870199.