Micromechanics Modeling of Automotive Instrument Panels

870199

02/01/1987

Event
SAE International Congress and Exposition
Authors Abstract
Content
The tensile modulus, fiber orientation distribution and fiber orientation angle in selected regions of an automotive upper instrument panel (IP) were examined for correlation with predicted modulus. A first molding trial of the IP was compared to the results of a second trial which incorporated several engineering changes. As expected, the fiber orientation varied within the panel as well as between molding trials. A micromechanics model was utilized to predict modulus as a function of the measured fiber orientation. These predictions were compared with experimental values for each region and molding trial. Excellent agreement between predicted and measured values was observed.
Meta TagsDetails
DOI
https://doi.org/10.4271/870199
Pages
12
Citation
Bozarth, M., "Micromechanics Modeling of Automotive Instrument Panels," SAE Technical Paper 870199, 1987, https://doi.org/10.4271/870199.
Additional Details
Publisher
Published
Feb 1, 1987
Product Code
870199
Content Type
Technical Paper
Language
English