Micro-Cooler for Chip-Level Temperature Control

1999-01-1407

4/6/1999

Authors
Abstract
Content
The objective of this paper is to design and fabricate a micro-cooler to provide integral cooling to electronics or Microelectromechanical Systems (MEMS) type components utilizing current MEMS technologies. A three-port capillary pumped loop (CPL) was analyzed and fabricated from silicon and quartz for this purpose. An analytical study of the device is presented in support of this design. This proves the feasibility of such a device, and thus the rationale for continuing its development.
Meta TagsDetails
DOI
https://doi.org/10.4271/1999-01-1407
Citation
Kirshberg, J. and Yerkes, K., "Micro-Cooler for Chip-Level Temperature Control," Aerospace Power Systems Conference, Mesa, Arizona, United States, April 6, 1999, https://doi.org/10.4271/1999-01-1407.
Additional Details
Publisher
Published
4/6/1999
Product Code
1999-01-1407
Content Type
Technical Paper
Language
English