Lead Free Cationic Electro-Deposition for Automobile Body in White

2003-01-2783

10/27/2003

Event
International Body Engineering Conference & Exposition
Authors Abstract
Content
Organic tin compounds were examined as replacements for the hardening catalyst function of lead in order to produce a lead-free cationic E-coat. The mechanism of the decline in adhesion, at the interface between the anti-chip primer and the primer surfacer, when an organic tin compound migrated to the anti-chip primer layer, was determined. Monobutyl tin compounds were found to have the lowest mobility within the film of organic tin compounds capable of functioning as hardening catalysts. A lead-free E-coat, employing a monobutyl tin compound, demonstrated no decline in adhesion, and the performance of the film was equivalent to that of conventional E-coat.
Meta TagsDetails
DOI
https://doi.org/10.4271/2003-01-2783
Pages
5
Citation
MORISHITA, H., and KANEKO, K., "Lead Free Cationic Electro-Deposition for Automobile Body in White," SAE Technical Paper 2003-01-2783, 2003, https://doi.org/10.4271/2003-01-2783.
Additional Details
Publisher
Published
Oct 27, 2003
Product Code
2003-01-2783
Content Type
Technical Paper
Language
English