Lead Free Cationic Electro-Deposition for Automobile Body in White
2003-01-2783
10/27/2003
- Event
- Content
- Organic tin compounds were examined as replacements for the hardening catalyst function of lead in order to produce a lead-free cationic E-coat. The mechanism of the decline in adhesion, at the interface between the anti-chip primer and the primer surfacer, when an organic tin compound migrated to the anti-chip primer layer, was determined. Monobutyl tin compounds were found to have the lowest mobility within the film of organic tin compounds capable of functioning as hardening catalysts. A lead-free E-coat, employing a monobutyl tin compound, demonstrated no decline in adhesion, and the performance of the film was equivalent to that of conventional E-coat.
- Pages
- 5
- Citation
- MORISHITA, H., and KANEKO, K., "Lead Free Cationic Electro-Deposition for Automobile Body in White," SAE Technical Paper 2003-01-2783, 2003, https://doi.org/10.4271/2003-01-2783.