Isolation Integration into Cold Plate and Thermal Densification of Liquid-Cooled Power Modules

Active cooling integration into substrates can be utilized to significantly improve power density per unit volume, reduce weight, and improve overall heat dissipation for power semiconductors. The principal limitation for semiconductor device reliability has been identified as device operating temperature for decades. Electronic systems that are required to operate in extreme environmental conditions require direct and highly efficient thermal management materials and solutions. This investigation compares traditional power semiconductor packaging and thermal management incorporating multiple thermal resistances to a novel substrate with integrated active cooling, utilizing proven and established materials introducing active cooling directly under the die.