Integration of Simulation and Testing for Microelectronics Package Reliability Improvement

Computer simulation has been used as a vital and powerful tool for evaluating stresses in microelectronics packages due to thermal-mechanical loading. Experimental measurement and reliability testing have been performed for modeling correlation and verification. In the past several years, the authors have been integrating computer simulation and testing to significantly improve package reliability at Motorola SPS. Several examples are presented for illustration and demonstration of the methodology.