Integrated Silicon Pressure Sensor for Automotive Application with Electronic Trimming

950533

02/01/1995

Event
International Congress & Exposition
Authors Abstract
Content
An integrated manifold pressure sensor using bulk silicon micromachining techniques is presented. The sensor incorporates the entire signal amplification, temperature compensation, and circuitry for electronic trimming of the sensor chip. The chip circuitry and the manufacturing and assembly process will be discussed. Trimming of the sensitivity and offset production tolerances as well as the temperature coefficients of sensitivity and offset is performed using an electrical trim method. A binary coded digital compensation information is serially fed into an on-chip control unit. The individual bits are decoded and sent to the gates of a bank of trimming thyristors. Once the correct binary code has been selected so that the sensor characteristic is centered in the specified range, the programming voltage is increased and the data is irreversibely stored similarly to the zener zapping method.
Meta TagsDetails
DOI
https://doi.org/10.4271/950533
Pages
8
Citation
Kress, H., Marek, J., Mast, M., Schatz, O. et al., "Integrated Silicon Pressure Sensor for Automotive Application with Electronic Trimming," SAE Technical Paper 950533, 1995, https://doi.org/10.4271/950533.
Additional Details
Publisher
Published
Feb 1, 1995
Product Code
950533
Content Type
Technical Paper
Language
English