High Temperature Creep Behavior of Ceramic and Metal Substrates

910374

02/01/1991

Event
International Congress & Exposition
Authors Abstract
Content
The high temperature creep data for radial specimens, cut from metal and ceramic substrates and subjected to compressive loads representative of mounting and thermal pressure are presented as function of load and temperature. These data show that the creep resistance of metallic specimens under sustained loading varies with temperature and is orders of magnitude lower than that of ceramic specimens. The observed creep deformation in metallic specimens reduces their open frontal area and hydraulic diameter with potentially adverse impact on pressure drop across the metallic substrate.
Meta TagsDetails
DOI
https://doi.org/10.4271/910374
Pages
16
Citation
Gulati, S., Geisinger, K., Reddy, K., and Thompson, D., "High Temperature Creep Behavior of Ceramic and Metal Substrates," SAE Technical Paper 910374, 1991, https://doi.org/10.4271/910374.
Additional Details
Publisher
Published
Feb 1, 1991
Product Code
910374
Content Type
Technical Paper
Language
English