High Strength versus Stress Relief In a Structural Bond

710108

02/01/1971

Event
1971 Automotive Engineering Congress and Exposition
Authors Abstract
Content
In bonding two materials differing in coefficient of expansion, one must either contain the stresses due to temperature cycling using a rigid adhesive, or allow the two adherends to expand and contract freely using an elastomeric adhesive. An experiment is described which demonstrates the extent that stresses can be contained when a rigid adhesive is used to bond materials of greatly different coefficients of expansion.
Meta TagsDetails
DOI
https://doi.org/10.4271/710108
Pages
8
Citation
DeLollis, N., "High Strength versus Stress Relief In a Structural Bond," SAE Technical Paper 710108, 1971, https://doi.org/10.4271/710108.
Additional Details
Publisher
Published
Feb 1, 1971
Product Code
710108
Content Type
Technical Paper
Language
English