High Strength versus Stress Relief In a Structural Bond
710108
02/01/1971
- Event
- Content
- In bonding two materials differing in coefficient of expansion, one must either contain the stresses due to temperature cycling using a rigid adhesive, or allow the two adherends to expand and contract freely using an elastomeric adhesive. An experiment is described which demonstrates the extent that stresses can be contained when a rigid adhesive is used to bond materials of greatly different coefficients of expansion.
- Pages
- 8
- Citation
- DeLollis, N., "High Strength versus Stress Relief In a Structural Bond," SAE Technical Paper 710108, 1971, https://doi.org/10.4271/710108.