High-Modulus/Low-Conductivity Windshield Adhesives for Better Body Stiffness, Comfort and Durability
980464
02/23/1998
- Event
- Content
- A life-cycle analysis of the direct glazing technology is given. Most of the latest changes and improvements were accomplished and implemented in Europe. The current status of direct glazing technology is also described and covers the following:
- High-modulus adhesives that significantly increase body stiffness on a weight-neutral basis.
- Low electrically conductive adhesives specially designed for aluminum cars that fulfill requirements for windshield- or backlite-integrated antenna systems.
- Instant-fix adhesives for easier mounting operations.
- A detailed discussion of the advantages and disadvantages of these technologies based on real practice.
- An outlook into the future of direct glazing.
- Pages
- 10
- Citation
- Symietz, D., and Walterspiel, B., "High-Modulus/Low-Conductivity Windshield Adhesives for Better Body Stiffness, Comfort and Durability," SAE Technical Paper 980464, 1998, https://doi.org/10.4271/980464.