High-Modulus/Low-Conductivity Windshield Adhesives for Better Body Stiffness, Comfort and Durability

980464

02/23/1998

Event
International Congress & Exposition
Authors Abstract
Content
A life-cycle analysis of the direct glazing technology is given. Most of the latest changes and improvements were accomplished and implemented in Europe. The current status of direct glazing technology is also described and covers the following:
  • High-modulus adhesives that significantly increase body stiffness on a weight-neutral basis.
  • Low electrically conductive adhesives specially designed for aluminum cars that fulfill requirements for windshield- or backlite-integrated antenna systems.
  • Instant-fix adhesives for easier mounting operations.
  • A detailed discussion of the advantages and disadvantages of these technologies based on real practice.
  • An outlook into the future of direct glazing.
Meta TagsDetails
DOI
https://doi.org/10.4271/980464
Pages
10
Citation
Symietz, D., and Walterspiel, B., "High-Modulus/Low-Conductivity Windshield Adhesives for Better Body Stiffness, Comfort and Durability," SAE Technical Paper 980464, 1998, https://doi.org/10.4271/980464.
Additional Details
Publisher
Published
Feb 23, 1998
Product Code
980464
Content Type
Technical Paper
Language
English