Heat Pipe Cooled Electronic Circuit Card as Applied to SEM FORMAT B Standard

Grumman developed, patented, and tested a heat pipe concept to increase the power dissipation capability of the SEM FORMAT B Standard Module. The systems integration concept approach in the development of the design was to:

• Provide a heat pipe module within the existing SEM FORMAT B form factor that would be interchangeable with the existing conduction module
• Utilize the short conduction path of the module
• Maintain the existing component mounting area
• Maintain thermal compatibility between the module and heat sink interface.

Within the restraints of these objectives, the Grumman concept was shown to be feasible and proven to be capable of providing a power dissipation capability twice that of the existing conduction module.