Flexible Multilayer Designs Provide Cost Effective Packaging Solutions
1999-01-0162
03/01/1999
- Event
- Content
- This paper discusses a variety of manufacturing techniques which have been developed to produce cost effective multilayer interconnects while overcoming the harsh environmental conditions imposed by the Automotive Industry. A comparison is made to the transition of Military Rigid-flex technology and materials needed to overcome the aerospace environment.
- Pages
- 6
- Citation
- DiPalermo, J., "Flexible Multilayer Designs Provide Cost Effective Packaging Solutions," SAE Technical Paper 1999-01-0162, 1999, https://doi.org/10.4271/1999-01-0162.