710797: Fabrication of Multilayer Ceramic Interconnection Boards - Technical Paper

Event: National Aeronautical and Space Engineering and Manufacturing Meeting

Authors

Elliott A. Kasten

Abstract

Content: The basic procedure for fabricating ceramic multilayer boards, for use with beam lead, flip chip, or flying lead semi-conductor devices is described.

Meta Tags

Topics: Ceramics
Fabrication
Semiconductors

Details

DOI: https://doi.org/10.4271/710797

Pages: 11

Citation: Kasten, E., "Fabrication of Multilayer Ceramic Interconnection Boards," SAE Technical Paper 710797, 1971, https://doi.org/10.4271/710797.

Additional Details

Publisher: SAE International

Published: 2/1/1971

Product Code: 710797

Content Type: Technical Paper

Language: English