An Experience Report: Step Stress Testing to Failure for Reliability Analysis of Electronic Equipment

This paper presents the results of a planned program to investigate step-stress-to-failure testing as a technique for design improvement and reliability evaluation of electronic equipment. The test philosophy is presented along with a discussion of the test set-up, method of data analysis, implications from test results, and advantages over present failure rate type testing. The implications and recommendations made are based on an actual test-to-failure performed on an item of modular electronic equipment.