Epoxy Adhesives for Automotive Assembly Operations

This paper describes several new epoxy adhesives and bonding processes specifically developed for high volume, low cost automotive assembly operations. The applications include halogen-quartz headlamps; assembly of a variety of under-the-hood electrical and electronic components; a one component epoxy body solder used since 1971 to replace lead in the exposed body joints of taxicabs and other vehicles; and low temperature curing, flexible epoxy adhesives used to increase the strength of steel body joints of school buses and other “rivet bonded” structures.